Stepmind details chips in support of Hiperlan2 and 4G
Stepmind details chips in support of Hiperlan2 and 4G
By Peter Clarke, Semiconductor Business News
February 17, 2003 (8:27 a.m. EST)
URL: http://www.eetimes.com/story/OEG20030217S0011
PARIS --- Stepmind SA, a fabless design house that specializes in wireless chips, has provided some details of a wireless LAN chipset capable of supporting both the IEEE802.11a and ETSI HiperLAN2 standards, and said it would introduce the first version, in mid 2003. "This total WLAN solution includes a WLAN baseband processor with its protocol software and a single-chip 5-GHz transceiver," said Andre Jolivet, business development manager and Stepmind founder, in a statement. "It achieves the highest integration, lowest component count and lowest BOM [bill of materials] on the market," he added. The internal architecture of the baseband chip is designed to support integration with an 802.11b modem and with Stepmind's GSM/GPRS/EDGE solution to provide support for a fourth generation, mobile communications platform, the company said. The 5-GHz RF transceiver is a zero intermediate frequency device that includes the synthesizer and voltage-c ontrolled oscillators. The chip is capable of emitting up to +10-dBm in both the American and European 5-GHz WLAN bands without any external power amplifier, the company said. As part of its offering Stepmind plans to provide software protocol stacks for IEEE802.11a and ETSI HiperLAN2, with standard network and application interfaces, such as CardBus for network interface card (NIC) products and Ethernet for Access Points.
|
Related News
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
- USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program
- Synthara targets breakthrough edge-AI chips with support from a global coalition of investors and R&D partners
- Chips&Media releases world's first HEVC and VP9 multi-format decoder IP with 10bit support
- Chips&Media's world first HEVC Codec IP with 10bit support licensed to semiconductor companies
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |