NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Comcores sells wireless assets to Analog Devices
Comcores strengthen its focus on Ethernet Systems and Chip-to-chip technologies
February 12, 2021 -- Comcores, a leading supplier of digital IP-cores and sub-systems for communication technology and interface solutions for ASICs and FPGAs, announces the sale of its wireless assets to Analog Devices, Inc. (ADI) a US-based company.
Operators are looking for more cost-effective and agile networks, and access to broader ecosystems and innovation motivates their move to virtualized platforms. This has triggered a strong momentum behind open, disaggregated RAN architectures in which the O-RAN standard is a key enabler to provide seamless connectivity of equipment. Comcores was offering the leading IP solution for enabling this type of open connectivity.
Analog Devices, Inc. plans to continue to evolve the wireless technology and participate in the O-RAN forum. The core team based in Denmark and headed by Comcores’s founder and former CEO, Thomas Noergaard, and the team in Krakow, Poland will be joining ADI in this transaction. Comcores’ other Polish office in Katowice will stay in Comcores as part of its chip-to-chip interface team.
Comcores’ other lines of intellectual property and digital systems business, Chip-to-Chip and Ethernet Systems IP, will continue under the new Comcores CEO, John Illerup Mortensen.
Comcores is extending its strong focus on new technologies and research to become a technology leader in select areas within wireless infrastructure, Ethernet communication technology and chip-to-chip interface technology.
Comcores is ramping up efforts in remaining technology areas and is having a strong focus to further develop its remaining business lines to enable world leading product solutions.
“The asset sales of Comcores’ wireless business to Analog Devices is an important step for Comcores in refocusing its business to have stronger impact in areas like Ethernet communication technology, timing and Chip Interfaces enabling next generation of ASICs,” said Thomas Gerner Nørgaard, founder and former CEO of Comcores.
|
Comcores Hot IP
Related News
- Analog Devices Collaborates With Altera To Streamline Wireless Infrastructure System Development
- TTPCom and Analog Devices, Inc. Agreement Speeds Customer Development of ADI SoftFone-based Wireless Devices
- Flex Logix Acquired By Analog Devices
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
- DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |