Startup Transforms Compute-In-Memory
By Sally Ward-Foxton, EETimes (April 8, 2021)
At the TinyML Summit, early-stage analog AI accelerator startup Areanna presented the first public reveal of its architecture, disclosing some of the features of its 40 TOPS/W SRAM array-based design. The unusual design integrates analog-to-digital and digital-to-analog conversion within the memory array. Since ADCs and DACs typically take up the vast majority of silicon area and power budget for compute-in-memory designs, integrating this functionality within the memory array could be a game changer for analog compute technology.
Areanna is led by former Tektronix analog design engineer Behdad Youssefi alongside another ex-Tek colleague, Patrick Satarzadeh. They remain the company’s only two full-time employees, alongside a couple of part time engineers and several advisors. The company has achieved a test chip with one computing tile based on its architecture up and running.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- Gelsinger Invests In British AI Chip Startup Fractile
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation