DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi 5 DSP

By Maurizio Di Paolo Emilio, EETimes (April 15, 2021)

DSP Concepts is announcing support for the Cadence Tensilica HiFi 5 DSP in its Audio Weaver platform, with a general release planned for the end of Q2 2021. The HiFi 5 is used for low power wireless products, headsets, wearables, and high-end automotive systems. DSP Concepts full suite of voice processing and playback IP will be made available allowing OEMs to create differentiated products leveraging Audio Weaver technology.

DSP-enhanced ARC EMxD and HS4xD processors provide combined RISC + DSP processing for computation intensive applications World's most advanced communication DSP, providing cutting-edge performance for multi-Gigabit class connectivity

In an interview with EE Times, Paul Beckmann, CTO and founder at DSP Concepts, highlighted how the Tensilica HiFi 5 DSP includes hardware acceleration to enable voice-controlled user interfaces and artificial intelligence (AI)-based audio applications.

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