Karen Rogge Joins Rambus Board of Directors
SAN JOSE, Calif. — May 4, 2021 — Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the addition of Karen Rogge to its Board of Directors.
Ms. Rogge is a proven executive with extensive finance and operations management experience at leading public technology companies including Hewlett Packard, Seagate Technology, and Extreme Networks, as well as private companies. She is president of the RYN Group LLC, a management consulting business. Ms. Rogge has served as a board director at Kemet Corporation, acquired by Yageo, and AeroCentury Corporation. Previously, she was CFO & senior vice president of Extreme Networks, a leading network solutions company. Prior to that, she was vice president of Corporate Finance, Treasurer, and Principal Accounting Officer at Seagate Technology. Earlier in her career, she held executive positions in finance and operations at Hewlett Packard.
“We are excited to welcome Karen to the Rambus board,” said Chuck Kissner, chairman of the Rambus Board of Directors. “She brings valuable board of director experience, expertise and insights to support the company’s strategic direction and ongoing growth.”
“Rambus’ products and technology are at the heart of some of today’s fastest growing markets,” said Ms. Rogge. “I am honored to join the board and look forward to helping guide the company in its future success.”
Ms. Rogge holds a Bachelor of Science in Business Administration with an accounting concentration, from California State University, Fresno and a Master of Business Administration degree from Santa Clara University.
|
Related News
Breaking News
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
- Xiphera Partners with IPro for the Israeli Chip Design Market
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
Most Popular
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
E-mail This Article | Printer-Friendly Page |