Rambus Advances New Era of Data Center Architecture with CXL Memory Interconnect Initiative
SAN JOSE, Calif. – June 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the CXL Memory Interconnect Initiative to define and develop semiconductor solutions for advanced data center architectures that maximize performance, improve efficiency and reduce system cost. To support the continuing growth and specialization in server workloads, data center is moving to disaggregated architectures composed from shared and scalable pools of computing and memory resources. Compute Express Link™ (CXL) is a critical enabler of these next-generation disaggregated server architectures. As part of this initiative, Rambus is focusing its initial research and development on semiconductor solutions to support key memory expansion and pooling use cases. The acquisitions of PLDA and AnalogX provide key products and expertise that complement the company’s leadership in server memory interface chips and further accelerate the roadmap for innovative CXL interconnect solutions for next-generation data centers.
“Modern server architectures are taking a revolutionary step forward to support the growing demands of advanced workloads like AI/ML,” said Luc Seraphin, president and CEO of Rambus. “This initiative is highly complementary to our existing server DIMM chipset business and brings together our unique combination of semiconductor and system expertise to develop breakthrough interconnect solutions that improve performance, security, efficiency and TCO for future data centers.”
CXL is an open industry standard interconnect delivering high-bandwidth, low-latency connectivity between dedicated compute, memory, I/O and storage elements within the data center to allow the provision of the optimal mix of each for a given workload. CXL memory expansion and pooling chips are key components for both traditional and disaggregated architectures. Rambus is uniquely positioned to deliver these solutions as a leading provider of the diverse set of required building blocks including:
- CXL and PCIe® PHYs and controllers to interface with host processors and other devices
- DDR memory PHYs and controllers to interface with memory devices
- Advanced cryptographic cores and secure protocol engines to enable secure firmware downloads and protect the links against data tampering and physical attacks with Integrity and Data Encryption (IDE) security
In addition, Rambus has extensive experience delivering memory interface chips at high volume to the server ecosystem and critical system-level expertise to speed time to market. Rambus is engaging with the full ecosystem including cloud, system and memory companies, to accelerate the development and enablement of CXL memory interconnect solutions.
For more information, visit rambus.com/cxlmemoryinterconnects
|
Related News
- Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD
- Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance
- GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
- Rambus Makes Server Memory Interface Chipset For Advanced Enterprise and Data Center Systems
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |