PCIe 5.0 Controller supporting Endpoint, Root Port, Switch, Bridge and advanced features
Synopsys PrimeShield Selected by Samsung Electronics to Maximize Energy Efficiency and Performance for Next-Generation Process Node Designs
Best-in-Class, Machine-Learning-Driven Technology from Synopsys Fusion Design Platform Delivers Design Robustness for Mobile, 5G and Automotive SoCs
MOUNTAIN VIEW, Calif., June 24, 2021-- Synopsys, Inc. (Nasdaq: SNPS) today announced its PrimeShield™ design robustness solution has been deployed by Samsung's System LSI Business on its advanced process technologies for next-generation designs spanning mobile, 5G and automotive applications. PrimeShield, accelerated by machine learning (ML) technology, improves design immunity to variation and maximizes energy efficiency and design performance for customers targeting high-growth applications. Part of the Synopsys Fusion Design Platform™, PrimeShield provides comprehensive voltage slack, design variation and global skew analysis to tackle design vulnerability stemming from variations for power and performance-sensitive designs.
"Samsung evaluated various solutions, and PrimeShield's innovative technology successfully addresses these variation challenges and delivers the quality-of-results advantages. Our extensive collaboration with Synopsys allows us to leverage our combined technologies to improve advanced-node design robustness and achieve new levels of power and performance," said Ilryong Kim, vice president of System LSI Design Technology at Samsung Electronics
PrimeShield enables designers to maximize energy efficiency and design performance. Accelerated by ML technology, PrimeShield performs fast Monte Carlo path simulation on critical timing paths 100-10,000X faster correlated with PrimeSim™ HSPICE®. Its patented design variation analysis with statistical modeling enables handling of large-scale SoCs with billions of cells within minutes versus days or weeks required by full statistical simulations.
"Robustness has become an essential design quality metric, in addition to power, performance, and area, for our leading-edge customers, such as Samsung," said Jacob Avidan, senior vice president of engineering for the Digital Design Group at Synopsys. "PrimeShield continues its technology advancements with machine learning-driven robustness analysis and optimization to improve design immunity to variation. As part of the Fusion Design Platform, it effectively helps deliver superior power and performance along with cost-effective designs for our customers."
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As an S&P 500 company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and offers the industry's broadest portfolio of application security testing tools and services. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing more secure, high-quality code, Synopsys has the solutions needed to deliver innovative products. Learn more at www.synopsys.com.
|
Synopsys, Inc. Hot Verification IP
Related News
- Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process
- Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
- Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process
- Synopsys Fusion Technology Enables Lower Power, Smaller Area, and Higher Performance on Samsung Foundry 7LPP Process with EUV
- Synopsys' Galaxy Design Platform Enables Superior Low-Power Designs on Samsung's 10-nm Process Technology
Breaking News
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
- U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
- CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
- BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
Most Popular
- Cadence to Acquire Intrinsix Corporation from CEVA
- Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena
- ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors
- OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
- Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |