CrossBar Aims to Secure Computing with ReRAM
PUFs offer another means of embedding security in hardware
By Gary Hilson, EETimes (August 16, 2021)
CrossBar Inc. is setting its sights on security with its resistive RAM (ReRAM).
The company will apply its technology for use in hardware security applications in the form of ReRAM-based cryptographic physical unclonable function (PUF) keys that can be generated in secure computing applications. This is a departure from its usual use as non-volatile semiconductor memory, said CEO Mark Davis in a telephone interview with EE Times, and opens new markets for CrossBar’s technology.
A PUF is a physical object that for a given input and conditions, otherwise known as a “challenge,” provides a physically defined “digital fingerprint” output that acts as a unique identifier, most often for a semiconductor device such as a microprocessor. PUF keys aren’t new, but online banking and the emergence of the Internet of the things (IoT) have created opportunities beyond digital security for dedicated electronic devices such as banking cards or payment terminals. The increased need for encryption or a digital signature means an increasing number of ASICs, microcontrollers, and SoCs are embedding hardware cryptographic accelerators or software cryptographic libraries.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- CrossBar Announces ReRAM Based PUF Keys
- eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
- ReRAM Proves Resistant To Invasive Attacks
- Weebit Nano demonstrates its first crossbar ReRAM arrays
- CrossBar Announces New ReRAM Use for FTP and OTP Memory Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation