Nokia, Huawei sign W-CDMA patent licensing deal
![]() |
Nokia, Huawei sign W-CDMA patent licensing deal
By John Walko, CommsDesign.com
March 10, 2003 (4:53 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030310S0006
HELSINKI, Finland Nokia and Chinese communications supplier Huawei Technologies have inked a patent cross-licensing agreement covering the manufacturing and sales of W-CDMA infrastructure equipment globally. The deal gives both companies access each other's Intellectual Property (IP) covering the W-CDMA standard at what they describe as 'a very competitive royalty rate'. Nokia says the agreement demonstrates its commitment to partnering with local suppliers in promoting WCDMA technology in China through lowering the threshold of technology transfer. It is also an important milestone for Chinese vendors to enter into international cross-license practices for the global W-CDMA market. W-CDMA has been adopted as the 3G technology standard by the majority of the world's mobile operators, and several of the operators planning 3G networks in China are planning to adopt this air interface standard. " We are very happy to cooperate wi th Chinese vendors like Huawei on this kind of agreement. It represents an important beginning of a process to make state of the art technologies available to more and more domestic manufacturers. Nokia is very happy to be in a position to be part of this process. Eventually, the benefits from this agreement will reach all the members of the industry in China," said David Ho, Vice President of Nokia Networks China. Xu Zhijun, vice president of Huawei Technologies, said while the company is building up its own IP portfolio in mobile technologies, it is also "keen to co-operate [on IP issues] with world leading manufacturers like Nokia. The WCDMA patent cross-license agreement between the two companies demonstrates our strong commitment to WCDMA."
Related News
- Nokia pushes for cap on W-CDMA patent royalties
- Nokia and Nokia Siemens Networks enter into patent license agreement with Huawei
- Cellular3G Uses eASIC’s Nextreme Structured ASICs for its TopHat™ W-CDMA (3GPP) Baseband Solution
- Xilinx and AXIS Announce Integrated Radio Card Platform for W-CDMA, WiMAX Standards
- NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric and Sharp to Jointly Develop Platform for W-CDMA Handsets
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |