Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform
Westford, Massachusetts -- December 20, 2021 -- TELEDATICS, an engineering company developing IoT-enabled products and platforms, announced today the world’s first open source, open hardware Wi-Fi HaLow-enabled development platform aimed at engineers, creators and experimenters that is launching on the Crowd Supply website.
The Teledatics TD-XPAH development platform is a product that supports long range IoT WiFi networks at distances of 1 kilometer or more. The IEEE 802.11ah “Halow” Wi-Fi protocol is supported by major industry players and is currently available in a variety of chip implementations from several vendors.
The Teledatics platform is fully compliant with the IEEE 802.11ah “Halow” Wi-Fi standard, operating in the Sub 1GHz license-exempt band. It delivers ultra-low-power, long-range connectivity, penetration through obstacles, and reliable data throughput that other IoT technology options promise, but with the added benefit of native TCP/IP support, mesh networking, simpler network integration, and enhanced WPA3 security.
“The open nature of the Teledatics platform will bootstrap 802.11ah development,” said James Ewing, founder and CEO of Teledatics. “The product allows the creation of wide area wireless networks on an easy-to-use, open platform that will spur IoT development across a range of disciplines and industries. And the $99.00 price makes it affordable for everyone”.
https://www.crowdsupply.com/teledatics-inc/halo-td-xpah
|
Related News
- Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign
- CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
- Toshiba's "Easy Prototyping" Solution for Custom SoC Development Platform Reduces Need for Customer's Own Design Resources
- Wi-Fi Alliance introduces low power, long range Wi-Fi HaLow
- Synopsys' embARC Open Software Platform Accelerates Development of ARC-based Embedded Systems for the Internet of Things
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |