Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
Industrial private networks see considerable infrastructure savings by deploying AccelerComm solutions
Southampton, UK - January 24, 2022 -- AccelerComm, the company supercharging 5G with a complete physical layer solution which increases spectral efficiency and reduces latency, today announced the findings of a report commissioned from Real Wireless, the independent wireless experts, which shows significant reductions in 5G Private network infrastructure costs by utilising AccelerComm’s 5G physical layer IP solution.
To get the full details of the research sign-up to a joint Webinar: 5G Private Networks: How maximising spectral efficiency can reduce infrastructure costs by a third and improve performance being hosted by Mobile World Live on February 1st at 10:00am ET/15:00 GMT.
“Private Networks are being increasingly widely deployed, in particular within vertical markets such as ports, factories and agriculture,” said Dr. Anastasios Karousos of Real Wireless. “However to be successful in these sectors, private networks must be delivered at a reasonable cost and provide increased efficiency and productivity.”
“Private networks are being used by the mobile industry as test-beds to rapidly deploy, trial and iterate on new technologies such as 5G and O-RAN. At the centre of this is the drive to make sure that 5G is delivered in a way which maximises ROI,” said Eric Dowek, Segment Marketing Director at AccelerComm. “This research from Real Wireless shows the clear benefits of our IP in helping to optimise infrastructure requirements and improve performance. It confirms that by adopting AccelerComm’s physical layer solution there are considerable benefits in infrastructure cost savings and performance, across a range of private and public network deployment scenarios.”
|
AccelerComm Limited Hot IP
Related News
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
- Lockheed Martin Prepares First 5G.MIL® Payload for Orbit
- AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
- Ceva Collaborates with Arm and SynaXG to Redefine Energy Efficient 5G NR Processing for Sustainable LEO Satellites and 5G-Advanced Wireless Infrastructure
- EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
Breaking News
- Strategies for Addressing More Complex Custom Chip Design
- M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
- EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
- Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP
- SoCs Get a Helping Hand from AI Platform FlexGen
Most Popular
- SoftBank Group to Acquire Ampere Computing
- Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
- Zero ASIC launches world's first open standard eFPGA product
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
- Menta Unveils 'Launch Pad' Low-Cost Embedded FPGA (eFPGA) Technology Access Program For Defense And Aerospace Customers
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |