Yellowstone technology provides quantum leap in memory signaling
LOS ALTOS, CA - March 24, 2003 - Rambus Inc. (Nasdaq:RMBS), a leading developer of chip-to-chip interface products and services, and Elpida Memory, Inc., a technology leader in Dynamic Random Access Memory (DRAM), today announced that Elpida has signed a licensing agreement to incorporate Rambus' Yellowstone interface technology into Elpida's high value-added DRAM product portfolio for high-bandwidth applications.
"We have evaluated a number of different advanced memory interface technologies and have concluded that the Rambus Yellowstone memory interface is one of the best the market has to offer,? said Hidemori Inukai, chief strategy officer for Elpida Memory, Inc. "Rambus continues to provide the market with extremely high-speed technology, and we believe Yellowstone will have a promising future in applications that need very high bandwidth.?
Yellowstone offers a quantum leap in performance in memory signaling while lowering system cost through pin-count reduction and support for low-cost, high-volume PCBs and packages. The flexible architecture enables memory solutions to satisfy various market needs over the next decade, including digital consumer, networking, and graphics applications.
"Elpida continues to be a very valuable partner for us in bringing high-performance, high-value products to the marketplace," said Laura Stark, vice president of Rambus' Memory Interface Division. "The Yellowstone architecture provides for high performance, low cost memory system designs, enabling system companies to deliver ultimate performance at consumer price points in their next-generation systems."
About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM, SDRAM, DDR SDRAM and Mobile RAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). For more information, visit Elpida's World Wide Web site at www.elpida.com.
About Rambus Inc.
Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging interface problems and bring industry-leading products to market. Rambus' interface solutions can be found in hundreds of computing, consumer electronic and networking products. Additional information is available at www.rambus.com.
Rambus is a registered trademark of Rambus Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.