Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology
Plano, Texas, USA -- March 16, 2022 -- Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.
“We continue to have a strong collaboration with UMC to provide comprehensive support for UMC’s process technologies for our mutual customers,” said Ravi Subramanian, senior vice president and general manager of IC Verification Solutions, Siemens Digital Industries Software. “Our Analog FastSPICE simulation technology complements UMC’s 28HPC U+ processes by providing our mutual customers with a highly accurate, high-performance verification solution. We look forward to our continued partnership with UMC for a wide range of technology nodes.”
Siemens‘ Analog FastSPICE platform provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits. It delivers a unified platform with mixed-signal and variation-aware verification capabilities that have superior accuracy, performance, capacity and functionality.
“Verification using Siemens‘ AFS platform on UMC’s production-ready 28HPC U+ process technology reduces the time for proof of analog, improves verification accuracy and accelerates the design process for our shared customers,” said David Chen, senior division director of Technology Development at UMC. “We look forward to continuing our collaboration with Siemens to provide more design and verification tools for a variety of high-growth markets and applications.”
UMC’s 28HPC U+ platform offers a good balance between cost considerations and chip performance, and is well-suited for a range of applications requiring high-speed and low-power consumption, including integrated circuits (ICs) for Wi-Fi, digital TV and flash controllers applications. Compared to the company’s 28nm technology, the high-performance, low-power 28HPCU+ platform can offer up to a 15 percent boost in performance.
To learn more about Siemens‘ Analog FastSPICE platform, please visit: https://eda.sw.siemens.com/en-US/ic/analog-fastspice/
Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit siemens.com/software or follow us on LinkedIn , Twitter , Facebook and Instagram . Siemens Digital Industries Software – Where today meets tomorrow.
|
Related News
- Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies
- Siemens' Calibre platform now certified for IFS' Intel 16 process technology
- Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology
- INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology
- Siemens extends support for Samsung Foundry's latest process technologies
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |