eMMC Holds Its Own Against UFS
By Gary Hilson, EETimes (July 21, 2022)
The embedded MultiMediaCard (eMMC) standard is no longer being updated. But that’s not keeping some vendors from innovating around the NAND flash storage device for use cases where it’s still the best option.
While Universal Flash Storage (UFS) was trumpeted as widely replacing eMMC when it debuted, it’s overkill for some applications. In an interview with EE Times, Eric Spanneut, vice president of flash global product management for Western Digital’s flash business unit, said eMMC works best for mid–range mobile devices and thin–and–light entry–level compute devices, as well as wide range of emerging applications. “eMMC is here to stay for a very long time,” he said.
With little fanfare, the company recently introduced its iNAND EM141 Embedded Flash Device, designed for applications that require high performance, reliable data storage, a small form factor, and efficient power consumption.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Synopsys Expands Memory Verification IP Portfolio with UFS, UniPro and eMMC to Accelerate Verification Closure for Mobile Designs
- UFS Set to Eclipse e-MMC
- Toshiba Ushers in UFS, Compares and Contrasts to e-MMC
- Why Do Hyperscalers Design Their Own CPUs?
- Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against Emerging Quantum Threats
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation