USB V3.1 Power Delivery Type-C Port Evaluation board for OTI9108 IP
New Economical RF-CMOS Process from austriamicrosystems Designed for Cost Sensitive Wireless Applications
San Jose, CA (April 8, 2003) - Offering chip designers a low cost alternative for wireless applications, the foundry business unit of austriamicrosystems recently announced the availability of its advanced 0.35µm RF CMOS process.
The CMOS base technology has been adapted for RF applications with state-of-the-art analog/mixed-signal features from austriamicrosystems' 0.35µm silicon germanium BiCMOS process. The CMOS technology is based on the production proven 0.35µm CMOS technology licensed from TSMC.
The process features high performance transistors and a comprehensive suite of high-quality passive components characterized and tuned for RF applications. The modular integration of linear resistors, high quality thick metal four spiral inductors and high precision linear capacitors using Metal Insulator Metal technology (MIM) makes this process ideal for a wide range of RF applications.
A RF HIT-Kit (austriamicrosystems High Performance Process Design Kit) is available both for the Cadence Analog Artist environment and the Agilents' Advanced Design System (ADS). A comprehensive library of digital and analog cells, with a complete set of fully characterized active and passive devices, supports mixed-signal radio-frequency SOC solutions.
"The addition of RF CMOS complements austriamicrosystems existing family of RF-processes, which includes SiGe and BiCMOS processes," states Peter Gasteiner, Senior Vice President and General Manger of austriamicrosystems Full Service Foundry Business Unit. "Our RF CMOS process satisfies customer demands for low cost, high integration semiconductor products supporting wireless applications in the 1 to 2 GHz bands."
Having already introduced its first RF-process (BICMOS) successfully as early as 1992, austriamicrosystems' expertise and continuing focus on manufacturability and service is reflected in "The European Chipless & Fabless IC Design House Report" from Future Horizons. In this report, austriamicrosystems has been recognized as the number one preferred foundry partner for RF-Processes for the fourth time running since 1998.
The advanced 0.35µm RF-CMOS process is available for production now, and will be produced in austriamicrosystems' state-of-the-art 8-inch SMIF wafer fabrication facility.
Offering well-established RF CMOS, high-voltage CMOS, BiCMOS and SiGe-BiCMOS processes, austriamicrosystems has successfully positioned itself in the mixed signal foundry market. By providing superior support during the design phase, high-end tools, and experienced engineers, austriamicrosystems is proving itself as an attractive analog mixed signal foundry partner, especially for fabless design houses.
About austriamicrosystems:
With headquarters near Graz, Austria, austriamicrosystems AG is one of the world's leading designers and manufacturers of highly integrated mixed signal ICs, and operates from 14 locations around the globe with more than 800 employees worldwide. The company combines more than 20 years of design capabilities, product and marketing know-how with a full service foundry specialized in mixed signal, RF and HV applications. For more information, contact austriamicrosystems, 8601 Six Forks Road, Suite 400, Raleigh, N.C. 27613, or call 919-676-5292, fax 509-696-2713.
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