Hyper Transport seen reaching 30 million ports in 2003
![]() |
Hyper Transport seen reaching 30 million ports in 2003
By Bernard Cole, EE Times
April 24, 2003 (6:42 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030424S0048
SAN FRANCISCO An industry study to be released next week estimates that the global port count for Hyper Transport switch fabric will exceed 30 million ports this year. International Date Corp. (IDC) said the forecast comes as other alternatives such as Infiniband are still struggling to produce the silicon they need to support the demand for a high-speed interconnects. By 2006, the IDC projects the number of ports will reach 200 million. Hyper Transport technology is licensed on a royalty-free basis through the Hyper Transport Consortium. The univeral chip-to-chip I/O technology that provides high bandwidth, low cost and compatibility with legacy shared-bus PCI I/O technology. Vernon Turner, IDC group vice president, said the 2003 projections are based on actual parts counts ot items shipped and silicon starts and products already committed to production by the end of 2002. Gabriele Satori, president of the consortium, said several different market segments have emerged that are planning products this year based on the HT spec. While the majority of shipments will be for future 64-bit workstations and desktop computers, substantial numbers are already being delivered in the growing number of computing and electronics segments, including game consoles and servers. "The acceptance and use of one of the switch fabrics across s number of different applications will be the determining factor in which alternative will finally dominate," Turner said.
Related News
- Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports
- Morse Micro Supercharges its Series B Funding Round with AU $30 Million Top-up from Major Superannuation Funds and Others
- QuickLogic Awarded New $3.0 Million eFPGA Contract
- Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |