Experts Weigh Impact of Intel-Arm Collaboration
By Anton Shilov, EETimes (May 15, 2023)
Intel Foundry Services and Arm agreed last month to optimize Arm’s IP for Intel’s upcoming 18A process technology (1.8 nm). The collaboration will focus on mobile designs and will undertake design technology co-optimization (DTCO) and system technology co-optimization (STCO), which means that Arm’s IP will be optimized both for Intel’s forthcoming production node and for the company’s advanced packaging technologies.
Intel Foundry Services and Arm will jointly fine-tune Arm’s IP using the DTCO methodology for Intel’s 18A manufacturing process to optimize performance, power and costs of upcoming designs. One of the key fruits of this collaboration will be development of “an Arm-based mobile SoC and silicon technology demonstration and reference platform for chip designs,” which is a rather broad definition of the work.
Meanwhile, Intel and Arm confirm that the work has commenced.
“The work will validate the performance, power and area utilization of Arm SoC designs on the Intel 18A process,” a spokesperson for Intel told EE Times.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Supply Chain Experts Weigh In on CHIPS Act
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Vector Informatik and Synopsys Announce Strategic Collaboration to Advance Software-Defined Vehicle Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation