How Will 5G Advanced Change RF Design?
By Gina Roos, EETimes (June 26, 2023)
The next transformation in cellular networks, 5G Advanced, will bring higher bandwidth, lower latency and higher energy efficiency to applications like enhanced mobile broadband, massive IoT and edge computing. While these are big benefits for mobile network operators, it is causing RF and component design challenges.
“There will be some new challenges in RF front-end [RFFE] component design for infrastructure due to increased instantaneous bandwidths and higher-frequency bands in FR3 that may be used to meet the ever-increasing bandwidth needs,” said Jeff Gengler, director of RF applications engineering at Qorvo Inc.
“On the component design side, increased integration within modules will significantly help address optimization and consistency of performance over more challenging specifications,” Gengler added. “Increased integration allows for more of the combined system to be tested and validated by the component provider. Integration decreases the size of the solution, which helps reduce cost and helps meet requirements for tighter array pitch at higher frequencies.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
- How Will Deep Learning Change SoCs?
- Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
- Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation