Xelic Launches Networking Core Offerings
April 18, 2003 – Xelic today announced standards based networking core offerings for ATM, GFP, POS, SONET/SDH, Digital Wrapper (G.709) in the telecommunications sector. These cores implement a flexible configuration architecture to allow for variable bus widths and data rates. Digital Wrapper cores are available for data rates of 2.5Gb/s (OTU1), 10GB/s (OTU2), and 40Gb/s (OTU3). SONET/SDH cores support data rates from 155Mb/s (OC-3) to 40Gb/s (OC-768). ATM, POS, and GFP processor cores provide various payload type mapping options. This initial launch is the first phase in Xelic's roadmap to provide reliable standards based cores to customers.
|
Related News
- Xelic Announces Availability of 40G Enhanced Forward Error Correction Core for Optical Transport Networking Applications
- AVnu Alliance Launches to Advance Quality of Experience for Networked Audio and Video
- Lantronix Launches Family of Turnkey Networking System-on-Chip Coprocessors for High-Volume, Low-Cost Products
- Luminary Micro Launches 27 Stellaris Microcontrollers Including the First Offering of Real- Time Networking with the ARM Cortex-M3 Processor
- Xelic Announces Family of SONET/SDH Transport Processor Cores for Integration into FPGA or ASIC Networking Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |