Server Processors in the AI Era: Can They Go Greener?
Avi Messica and Ziv Leshem (NeoLogic)
EETimes (November 9, 2023)
The more power-efficient they get, the more the data center’s workload pulls them back to a more distant starting point.
“Just when I thought I was out, they pull me back in,” Michael Corleone (Al Pacino) says in “The Godfather Part III.” Much the same might be said of server processors: The more powerful and power-efficient they get, the more the data center’s workload pulls them back to a more distant starting point.
As data centers continue to expand in scale, complexity and connectivity, their power consumption increases as well. According to the International Energy Agency, data centers and data transmission networks are responsible for 1% of energy-related greenhouse gas emissions. The estimated global data center electricity consumption in 2022 was 240 TWh to 340 TWh, or about 1% to 1.3% of global electricity consumption, excluding energy that was spent for cryptocurrency mining.1 According to some sources, it reaches 3% and tops industries like aviation, shipping, and food and tobacco.
Despite great efforts to improve processors’ efficiency, the rapid growth of AI workloads has resulted in a substantial increase in energy consumption over the past decade, growing by 20% to 40% annually. The combined electricity consumption of the Amazon, Microsoft, Google and Meta clouds has more than doubled between 2017 and 2021, rising to about 72 TWh in 2021.1
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Can AI Design a Better Chip Than a Human?
- Can IBM Ecosystem Advance AI Chip Performance 1000x?
- Can ARM succeed in the entry-level server space?
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation