Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
LSI Logic Hypertransport physical interface core power high-speed data transfer rates
- Provides aggregate bandwidth of up to 12.8 Gigabytes per second
- Available in LSI Logic Gflx™ 0.11-micron CoreWare® Library
- Ideal for use in LSI Logic RapidChip™ platform and design environment
- GDA Technologies confirms interoperability
MILPITAS, Calif., May 27, 2003 – Demonstrating its commitment to dramatically increase the performance of next-generation computation and telecommunications systems, LSI Logic Corporation (NYSE: LSI) today announced the availability of its HyperTransport™ physical interface (PHY) core, offering an aggregate bandwidth of 12.8 Gigabytes per second (GBps). The LSI Logic HyperTransport PHY core is immediately available for ASIC customers as part of the company's Gflx™ 0.11-micron process technology CoreWare® library and is ideal for use with LSI Logic's innovative RapidChip™ platform ASIC products.
HyperTransport interconnect technology is a popular high-speed, high-performance, point-to-point link for integrated circuits, developed to enable the chips inside high-performance communications, storage and networking devices to communicate with each other faster than with existing technologies.
LSI Logic is a Contributor member of the HyperTransport Consortium, providing expertise in influencing next generation specifications.
"The LSI Logic HyperTranport PHY core adds a new high performance interface to our extensive CoreWare IP portfolio and enables us to maintain leadership in rapidly providing new I/O interfaces to our customers," said Tom Sandoval, vice president, Communications and ASIC Marketing, LSI Logic Corporation. "This is a robust solution that addresses the bandwidth and scalability requirements for new generations of high-performance devices."
The LSI Logic HyperTransport PHY core is compliant with the HyperTransport Technology PHY Interface Specification (Version 1.01) and the HyperTransport I/O Link Protocol Specification (Version 1.03). LSI Logic has performed interoperability testing with GDA Technologies' popular HyperTransport IP designed to help enable HyperTransport adopters to launch HyperTransport technology-based products in a timely manner.
"GDA's proven high quality HyperTransport IP for Cave, Tunnel, Host and Bridge implementations combined with LSI Logic's HyperTransport PHY core provides customers with a pre-verified IP solution that will help shorten time-to-market and cut the cost of product development," said Prakash Bare, vice president of IP Business at GDA Technologies. "We are pleased to be partnering with LSI Logic to speed the development of highly integrated HyperTransport solutions."
Key features of LSI Logic HyperTransport PHY Core
- Building blocks in designing HyperTransport subsystems
- Data rate scalable from 400Mbps to 1.6Gbps
- Supports 2/4/8/16/32-bit link in each direction
- Single PLL supports up to 32 channels
- High-speed HyperTransport LVDS I/Os
- Supports wire-bond and flip chip packages
- Compliant with HyperTransport I/O Link Specification Version 1.03
LSI Logic's success with companies such as GDA positions it as the leading ASIC/SoC/Platforms solution provider. The company offers unprecedented versatility for ASIC/SoC/Platforms and standard products for the communications, consumer and storage markets. Customers can design scalable and expandable customized solutions by making use of LSI Logic's extensive library of CoreWare® IP blocks, including GigaBlaze® and HyperPHY™ high-speed SerDes, 10/100 Ethernet PHY, 10/100/Gig/10Gig MACs, XGXS, PCI Express, PCI, PCI-X, PCI-X 2.0, DDR, ARM and MIPS processors, AMBA peripherals and pre-integrated CoreWare subsystems based on these IP blocks. In addition, LSI Logic's world-class flxI/O™ flip chip ball grid array package family and standard package families provide cost-effective, high performance solutions.
About LSI Logic Corporation
LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com.
|
Related News
- LSI Logic Simplifies High-Speed Serial Interface Design with Expanded Rapidchip Xtreme Family of Platform ASICs
- LSI Logic DDR interface core delivers up to 400Mb/s for high-speed DDR SDRAM applications
- LSI Logic first with Serial ATA 1.0 ASIC implementation - expands high-speed interface portfolio
- Virage Logic's DDR Memory Controller Interface Provides High Performance Data Transfer at Higher Efficiency and Lower Power
- Opulan Selects ARM High-Speed Physical Interface Solution For Next Generation Network SoC Designs
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |