Low-leakage LDO in TSMC 22ULL to supply logic and analog domains (up to 3.63V input supply)
Consortium brings 'Spirit' to IP integration
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Consortium brings 'Spirit' to IP integration
By Michael Santarini, EE Times
June 3, 2003 (9:19 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030603S0022
ANAHEIM, Calif. A new silicon intellectual property (IP) consortium, called Spirit (Structure for Packaging, Integrating, and Re-using IP within Tool flows), was launched Monday (June 2) at the Design Automation Conference (DAC) here. The consortium aims to ensure IP metadata can be easily transferred between IP vendors, EDA companies, semiconductor and systems companies.
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