Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
By Alan Patterson, EETimes (December 3, 2024)
The sudden departure of Pat Gelsinger as the CEO of Intel leaves the struggling U.S. chipmaker adrift, according to analysts who spoke to EE Times.
The company’s plan to ramp production of its 18A chips and regain process technology leadership is unclear. Intel has lost market share in its core CPU business to AMD while failing to gain traction in smartphone and AI chips. Intel’s effort to divest its chipmaking unit, Intel Foundry, as a successful standalone business is likely to take years, and doing so could forfeit its CHIPS Act subsidies. Intel Foundry needs to catch up in quality and cost where larger rival Taiwan Semiconductor Manufacturing Co. (TSMC) is the leader.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
- IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
- ARC CEO: 'Impatient capital' hinders U.S. IC industry
- Intel's New CEO Called "Strong Choice" to Respin Company
Breaking News
- Alphawave IP Response to announcement from Qualcomm
- Qualcomm considers buying Alphawave Semi
- Arteris Opens New Engineering Hub in Poland
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications
Most Popular
- Movellus and RTX's SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs
- Intel brings 3nm production to Europe in 2025
- Silicon-Proven MIPI CSI-2 & DSI-2 Tx/Rx IP Cores for your Camera & Display SoCs
- Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
- EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win