Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
MILPITAS, Calif. — February 13, 2025 — In the second half of 2024, worldwide silicon wafer demand started to recover from the industry downcycle seen in 2023, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. Worldwide silicon wafer shipments in 2024 decreased 2.7% to 12,266 million square inches while wafer revenue contracted 6.5% to $11.5 billion over the same period.
In 2024, a broad-based inventory correction was slower due to the weak end demand from the higher volume segments impacting fab utilization rates and wafer shipments to specific applications. The recovery is expected to continue into 2025 with stronger improvements toward the second half of the year.
"Generative AI and new data-center construction has been a driver for the most advanced foundry and memory devices such as High Bandwidth Memory (HBM), but most other end markets are still recovering from excess inventory,” said Lee Chungwei (李崇偉), Chairman of SEMI SMG and Vice President and Chief Auditor at GlobalWafers. “As noted by many customers in their earnings statements, the industrial semiconductor market is still in a strong inventory correction, and this has impacted silicon wafer shipments worldwide.”
Annual Silicon* Industry Trends
| 2020 | 2021 | 2022 | 2023 | 2024 |
Area Shipments (MSI) | 12,407 | 14,165 | 14,713 | 12,602 | 12,266 |
Revenues ($Billion) | 11.2 | 12.6 | 13.8 | 12.3 | 11.5 |
Source: SEMI (www.semi.org), February 2025
*Data cited in this release include polished silicon wafers, including those used as virgin test wafers, as well as epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to end users. Shipments are for semiconductor applications only and do not include solar applications.
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks, produced in diameters of up to 300 mm, serve as the substrate material on which most semiconductor devices, or chips, are fabricated.
The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.
For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics.
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org to learn more.
|
Related News
- Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments and Revenue Fall in 2023, SEMI Reports
- Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports
- Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2021, SEMI Reports
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |