QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer
SAN JOSE, Calif., Feb. 27, 2025 -- QuickLogic Corporation (NASDAQ: QUIK), a leading developer of embedded FPGA (eFPGA) IP and User Tools, ruggedized FPGAs, and Endpoint AI/ML solutions, is proud to announce its selection by a Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries'® 12LP, 12nm low-power process. IP delivery for this contract is scheduled during Q2 2025.
"For more than three decades, QuickLogic has built a strong reputation as a trusted supplier of SWaP-C-optimized programmable logic to the Defense Industrial Base," said Brian Faith, CEO of QuickLogic. "With our proven eFPGA Hard IP available across multiple fabrication processes—including GlobalFoundries 12LP—we're able to deliver rapid, design-specific solutions that reduce program risk and capitalize on our extensive development efforts and investments."
For more information on QuickLogic's customized eFPGA solutions, including commercial, ruggedized and radiation hardened versions.
About QuickLogic
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, discrete FPGAs, and endpoint AI solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for industrial, aerospace, consumer, and computing markets.
|
QuickLogic Corp. Hot IP
Related News
- QuickLogic Awarded New $3.0 Million eFPGA Contract
- QuickLogic Announces a New $1.5 Million eFPGA Contract
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- QuickLogic Announces $5.26 Million Contract Award
- QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
Breaking News
- Cadence Joins Intel Foundry Accelerator Design Services Alliance
- China Bets on Homegrown Chip Tech With RISC-V Push
- The Case for Hardware-Assisted Verification in Complex SoCs
- SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core
- TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
Most Popular
- Intel's New CEO Called "Strong Choice" to Respin Company
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
- BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM
- Vector Informatik and Synopsys Announce Strategic Collaboration to Advance Software-Defined Vehicle Development
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |