Hellosoft Inc., a provider of software intellectual property for wireless communications, raises $11 million
Hellosoft raises $11 million, eyes an IPO
By K.C. Krishnadas, EE Times
June 19, 2003 (2:06 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030619S0039
BANGALORE, India Hellosoft Inc., a provider of software intellectual property for wireless communications, has raised more than $11 million in venture capital, to be used mainly to fund sales and marketing plans. The company (San Jose, Calif.), which has its design center in Hyderabad, India, raised the funds from Venrock Associates, Sofinnova Ventures, Acer Technology Ventures and Jumpstartup Fund Advisors. Rama Rao Sreeramaneni, cofounder and general manager of Indian operations for Hellosoft, said the venture funding will take Hellosoft to the initial public offering stage, proposed for 2004. The company is working on a fully configurable wireless LAN solution. "This unique offering allows semiconductor vendors the optimal path to integrate wireless LAN functions into next-generation SoCs," he said.
|
Related News
- Imagination to acquire HelloSoft, a leading global provider of Video and Voice over Internet Protocol and wireless LAN technologies, for a maximum consideration of $47 million
- Conexant Sells Wireless Intellectual Property for $15 Million
- Blu Wireless raises $16.6 million in growth funding round for 5G applications
- AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series C
- Quantenna Communications Raises $79 Million Led by RUSNANO and Sequoia Capital
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |