Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
April 24, 2025 -- Allegro DVT, the leading provider of video processing silicon IPs and video compliance streams, has announced that its D310 AV1 decoder silicon IP is silicon proven having been integrated into SoCs designed into various advanced silicon processes down to 3nm.
Allegro DVT’s D310 IP is part of the D300 series highly customizable silicon IP family that builds on a scalable architecture allowing picture resolutions ranging from HD/4K up to 8K/16K while providing support for sample sizes from 8-bit to 12-bit and chroma subsampling from 4:0:0 up to 4:4:4.
Allegro DVT is able to address the growing demand of state-of-the-art video processing blocks in advanced System-on-Chips (SoCs) by providing highly configurable decoding IP core supporting a variety of selectable codecs. In addition to AV1, the D300 series also supports JPEG, H.264, HEVC, VP9 and VVC video formats. Furthermore, Allegro DVT’s unique and scalable architecture approach offers the best trade-off between silicon size and power consumption and keeps the operating frequency of the resulting 8K solutions at a reasonable level to allow physical implementations in mainstream and cost-efficient process node technologies.
For more information, contact us.
|
Allegro DVT Hot IP
Related News
- World's First AV1 Decoder Silicon IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
- Allegro DVT Releases New Versions of its Encoder and Decoder IPs with Support for 12-bit sample size and 4:4:4 Chroma Format
- Allegro DVT Adds Support of 4:2:2 10-bit Video Profiles to its Multi-Format Encoder/Decoder Hardware IPs.
- Allegro DVT improves its HEVC Decoder silicon IP with 10 bit support
- T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |