NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Derivative Suit Against Rambus Dismissed
LOS ALTOS, CA, July 10, 2003 -- Rambus Inc. (Nasdaq:RMBS), a leading provider of chip-to-chip interface products and services, today announced that the Court of Chancery of the State of Delaware has issued a stipulated order dismissing without prejudice the amended complaint in a consolidated derivative case against Rambus.
The dismissed derivative case arose from allegations concerning Rambus' 1991 - 1995 attendance at a standard setting body called JEDEC. The plaintiffs in this case agreed to stipulate to dismissal without prejudice following rulings favoring Rambus from the Court of Appeals for the Federal Circuit.
"Dismissal of this derivative case follows the path set by the Federal Circuit in its January ruling and in its en banc ruling in April," said John Danforth, vice president and general counsel for Rambus. "As with the recent dismissal of the shareholder class action against Rambus, we view this deference to the reasoning of the Federal Circuit as a further positive step."
About Rambus Inc.
Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus' interface solutions can be found in numerous computing, consumer electronic and networking products. Additional information is available at www.rambus.com.
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |