Quad density memory technology to be offered on UMC's advanced logic processes
SUNNYVALE, Calif., July 14, 2003 – MoSys, Inc. (NASDAQ: MOSY) the industry's leading provider of high density SoC embedded memory solutions, today announced it will port its innovative quad density 1T-SRAMÒ-Qä technology to UMC's 0.13-micron and 90-nanometer logic processes. This extends the existing cooperation between the companies to offer additional optimized high-density memory solutions to UMC's foundry customers, which already include the 0.13-micron silicon proven 1T-SRAM-R.
"We are pleased to cooperate with UMC for the support of our 1T-SRAM-Q technology," noted Mark-Eric Jones, vice president and general manager of Intellectual Property at MoSys. "This addition broadens the range of options for UMC's foundry customers requiring integration from one to hundreds of megabits of SRAM in their SoCs."
MoSys' 1T-SRAM-Q technology achieves its exceptional density by using bit cells of just 0.5-square microns in the 0.13-micron logic process and 0.28-square microns in the 90-nanometer logic process. Using only one additional, non-critical mask on the standard logic process, 1T-SRAM-Q enables cost-effective integration of large amounts of SRAM on SoC designs without any change to the other logic IP blocks or libraries
Founded in 1991, MoSys (NASDAQ: MOSY), develops, licenses and markets innovative memory technologies for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM memory results in the technology achieving much higher density than traditional four or six transistor SRAMs, while using the same standard logic manufacturing processes.1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, these technologies can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making it ideal for embedding large memories in System on Chip (SoC) designs. MoSys' licensees have shipped more than 50 million chips incorporating 1T-SRAM embedded memory, demonstrating the excellent manufacturability of the technology in a wide range of silicon processes and applications. MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys' website at http://www.mosys.com.
Note for Editors:
1T-SRAM® is a MoSys trademark registered in the U.S. Patent and Trademark Office. All other trade, product, or service names referenced in this release may be trademarks or registered trademarks of their respective holders.