July 16, 2003 - TTPCom, the world's leading independent supplier of digital wireless technology, today released its multi-slot Class 12 EDGE reference module. This solution is the culmination of extensive in-house development and interoperability (IOT) testing, against all leading infrastructure providers and in collaboration with EDGE operators. During lab tests TTPCom's EDGE solution achieves the maximum on air data rate of 236.8 kbps for a 4-slot capable mobile using the highest EDGE coding scheme, MSC-9. This performance more than triples the data rates previously achievable with GPRS, and sets a new benchmark for data rates over GSM networks.
The credit card-sized module contains all the circuitry required for a complete EDGE modem with additional interfaces supplied for product development and testing. Its modular design – which enables different radios to be supported – offers developers maximum flexibility. The EDGE module offers the following:
- For manufacturers, a proven implementation of the TTPCom/ADI EDGE reference design, suitable for development of EDGE PC-cards, PDAs, embedded modules and handsets.
- Enables infrastructure providers and network operators, in collaboration with TTPCom, to carry out field testing on live EDGE networks and support verification of new features, both Release 99 and Release 4, including GERAN Feature Package 1, on both the network and mobile side.
The platform was first demonstrated at the CTIA Wireless 2003 Show in New Orleans in March; TTPCom and ADI have used the intervening months to conduct extensive interoperability trials to validate the robustness of the solution. "The shipping of this product represents the conclusion of over two years of technical development, and nine months of operator testing on infrastructure from all major base station manufacturers. The product fulfils the promise of EDGE, with 236.8 kbps in both transmit and receive," said Greg Matthews, EDGE Product Manager, TTPCom. "We will be demonstrating the module at Wireless Japan in Tokyo next week."
The full range of new EDGE features including link adaptation, incremental redundancy and all EDGE coding schemes including 8PSK, have been verified during IOT testing. To ensure maximum coverage, testing has been performed in accordance with the EDGE Task Force interoperability test specification. System validation has included full integration and verification with TTPCom's GPRS protocol stack in order to ensure that the move to EDGE is as seamless as possible for TTPCom's existing customers.
The module is based on TTPCom's EDGE Protocol Stack and Physical Layer running on Analog Device's BlackfinÒ SoftFone™ EDGE platform. ADI's solution spans the microphone-to-antenna signal chain and incorporates a digital baseband processor, high-performance mixed-signal analogue baseband chip with integrated power management, ADI's OthelloÒ direct-conversion RF transceiver with polar modulator and dual-mode power amplifier functions.
"Analog Devices and TTPCom have been working together to develop leading-edge GSM and GPRS products for ten years. The latest result of this collaboration, the EDGE module, addresses the growing demand for the high speed data and voice access that the EDGE standard provides and allows phone manufactures to develop EDGE handsets today," said Mark Martin, Product Line Director, RF and wireless systems, Analog Devices, Inc.
As a result of ADI's broad signal processing expertise, Analog Devices' Blackfin SoftFone EDGE Platform supports multimedia applications such as streaming MPEG4 video and offers a number of benefits not currently available, including a scalable clock speed up to 247 MHz to implement voice codec, RF signal equalisation algorithms and multimedia processing; full support of quad-band and Class 12 EGPRS operations; peripheral interfaces, including USB, IR, Secure Digital (SD), MultiMedia Card (MMC) and serial and parallel ports for colour displays, monochrome displays and cameras.
To see a demonstration of the EDGE module please visit TTPCom's stand number 931 at Wireless Japan, Tokyo International Exhibition Centre, 16th-18th July 2003.