Xignal Technologies reduces VDSL equipment costs by 25%
Xignal’s CMOS-Based Analog Front End (AFE) Intellectual Property (IP) Makes Possible First Single-Chip VDSL Solutions in Industry
Munich, Germany, August 4, 2003 - Xignal Technologies AG, a leading IP solutions provider for the communications semiconductor industry, today announced the release of its CMOS-based mixed signal integrated circuit (IC) AFE design, immediately available for licensing.
This AFE is designed using mainstream pure CMOS process and is available for licensing for usage in the first-ever single-chip solution in the VDSL industry. The new AFE, which is also the first in the industry to include the line driver and lightning protection, reduces system complexity and required real estate on the board. These product features lead to quicker time-to-market and reduced bill of material for new VDSL equipment – ideal for high-volume production.“The flexibility and performance of our new VDSL AFE makes it agnostic to the choice of VDSL line codes, enabling our customers to move forward regardless of the preferred line code scheme," said Yousif Ammar, President at Xignal. “By making single-chip designs possible for VDSL equipment, the Xignal team has broken a critical barrier to profitable, mass-market penetration of VDSL services worldwide.”
Xignal’s VDSL core family has two products: a dual AFE with line driver (XT20502) intended for DSL access multiplexers (DSLAMs) and a single AFE with line driver (XT20501) for customer premises equipment (CPE).
Due to a patented cancellation technique, an unprecedented distortion and intermodulation specification has been achieved, making it feasible for different line coding schemes to be used. Another unique feature is the provisioning of the full 12 MHz bandwidth in both transmit directions, which allows for standardized or customized frequency plans. CMOS implementation of Xignal’s cores makes it feasible to integrate VDSL CPE with 802.11 Wi-Fi processors on a single die.
Performance and flexibility have been key design objectives for these cores. The high level of integration and integrated adaptive hybrid virtually eliminates the need for all external discrete components with the exception of the line transformer.
About Xignal Technologies AG
Xignal Technologies is a leading IP solutions provider that creates innovative, cutting-edge analog solutions for advancing the design and manufacturing of communication systems ICs. With a focus on high-growth market segments, Xignal’s technology shortens design cycles, reduces costs and increases speed-to-market. The Xignal Technologies headquarters are located at Leipziger Strasse 16, D-82008 Unterhaching, Munich, Germany. Additional information is available at http://www.xignal.com.
###
© 2003 Xignal Technologies AG. All rights reserved. Xignal Technologies is a registered trademark of Xignal Technologies AG.
|
Related News
- Fab Equipment Spending Up 25% in 2014
- Open-Silicon Introduces Multi-Layer Mask Program: Reduces Mask Costs by up to 50% for 90nm and Smaller Lithographies
- Agere Systems Announces Platform for Wireless Equipment that can Shave More Than $25 Million in Software Costs
- Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
- Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |