Agere revamps DSP, ARM interface in mobiles
Agere revamps DSP, ARM interface in mobiles
By Robert Keenan, CommsDesign.com
August 12, 2003 (5:51 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030812S0029
WAYNE, N.J. Agere released a messaging interface Tuesday(Aug. 12) that could change the way DSP and ARM microprocessor cores exchange data and control commands in the baseband section of a mobile phone architecture. The baseband processing section of a mobile phone typically houses a DSP core handling Layer 1 processing tasks and an ARM processor handling control functionality. The processor cores rely on AT commands to exchange information. According to Agere, the AT command creates several problems in mobiles, including the lack of parallel processing, an unproven multiplex protocol and the need for non-standard AT commands to control the GPRS engine. Agere said its new messaging interface overcomes these limitations by using software that enables parallel processing, allowing simultaneous data and control commands over a single physical interface. The interface also supports packet-switched operation. Agere expects to includ e the messaging interface in a GPRS chip set being delivered to select customers in the fourth quarter. The chip sets will be generally available in early 2004.
Related News
- ARM Extends Software Interface Standard with DSP Library
- ARM Announces Availability Of DSP Interface Specification
- LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
- Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols
- Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
E-mail This Article | Printer-Friendly Page |