Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
U.S. Patent & Trademark Office Nullifies Major Claims in MIPS® Patent on Unaligned Loads and Stores
U.S. Patent & Trademark Office Nullifies Major Claims in MIPS® Patent on Unaligned Loads and Stores
SAN JOSE, CA (June 14, 2001) - Lexra, a leading developer of 32-bit RISC, DSP and NPU cores for the embedded market, today announced that the U.S. Patent and Trademark Office (PTO) has rejected all claims in Patent number 4,814,976 (`976) that MIPS Technologies Inc. [NASDAQ: MIPS, MIPSB] asserted Lexra violated. In its petition for re-examination, Lexra cited a patent issued to IBM® Corp.- patent number 3,916,388, entitled "Shifting Apparatus for Automatic Data Alignment"- that predates the `976 patent by more than 10 years. With this ruling the PTO agreed with Lexra's contention.
"We are extremely pleased with the PTO's ruling," stated Charlie Cheng, president and CEO of Lexra. "It confirms what we have consistently contended that our technology does not violate any patents."
The MIPS `976 patent contains a total of fourteen claims. In its ruling the PTO rejected six of the fourteen including all four - claims 9, 10, 12 and 13 - that were asserted against Lexra.
The `976 patent encompasses a technique for loading and storing unaligned data. The patent describes a method for transferring a word between a CPU's general-purpose register file and its memory when the word moved is split between two memory locations. Implementing two instructions, IBM, a computer industry pioneer, devised the same method for its mainframe computers to achieve an optimal result and received a patent for the technique in 1975. The technique is particularly useful for commercial and banking computer applications involving manipulation of large numbers of alphanumeric characters.
In the PTO reexamination process, MIPS Technologies Inc. will have two months to respond before the PTO ruling is final. Lexra is confident that the PTO's current ruling will stand.
About Lexra
Lexra, Inc. is a leading microprocessor developer specializing in 32-bit RISC, DSP and NPU cores for the embedded market. In less than four years, the company has established itself as an innovator in embedded microprocessor technology and intellectual property (IP) licensing business model, with proven track record for customer success. During this short period, Lexra has delivered nine different processors to over 30 licensees in six different countries. Its customers are among the top three network communication companies as well as the top ten semiconductor companies. Lexra is headquartered in San Jose, Calif. Further company information can be found at http://www.lexra.com.
* MIPS and other MIPS common law marks are trademarks and/or registered trademarks of MIPS Technologies, Inc. IBM is a registered trademark of IBM Corp. Lexra, Inc. is not associated with MIPS Technologies, Inc. in any way.
For Immediate Release
Lexra Contact:
Jonah McLeod
Director of Marketing
Lexra, Inc.
San Jose, CA
(408) 573-1890
mcleod@lexra.com
Press Contact:
Katie Olivier
Account Executive
Shelton Communications Group
Dallax, TX
(972) 239-5119
kolivier@sheltongroup.com
Related News
- U.S. Patent and Trademark Office Confirms All Claims In MIPS Technologies Patent
- U.S. Patent And Trademark Office Rejects Additional Patent Claims That Rambus Is Asserting Against NVIDIA
- U.S. Patent and Trademark Office Rejects Patent Claims That Rambus is Asserting Against NVIDIA
- US Patent and Trademark Office (USPTO) Rejects All Claims of Sidense's Key Patent ('855) and Orders Reexamination
- IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |