Open-Silicon to Showcase IoT ASIC Platform and IoT Gateway SoC Platform along with Comprehensive HBM2 IP Sub-System Solution at The IoT DevCon Santa Clara on April 26-27, 2017

Apr. 11, 2017, Apr. 10, 2017 – Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting at the IoT DevCon Santa Clara on April 26-27, 2017 to demonstrate the company's IoT ASIC Platform and IoT Gateway SoC Platform. Visit our booth on exhibition floor to view the demos and also to learn about other innovative ASIC/SoC solutions including Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ and 2.5D SoC Solution.

1. IoT ASIC Platform - This demonstrates end-to-end communication between sensor hubs and cloud platform through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. The Industrial IoT system setup is a part of Open-Silicon's Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at system level.
2. IoT Gateway SoC Platform - Company will be demonstrating end-to-end communication between edge devices/sensor hubs, gateway and cloud. The IoT Gateway SoC Platform applications include Smart Homes, Smart Waste Management, Smart Transport, Smart Traffic, Smart Parking, Smart Lighting, Smart Metering, etc. At its booth, company will be demonstrating Smart Lighting and Smart Parking in action.
3. Comprehensive HBM2 IP Sub-System Solution - The solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). Open-Silicon's IP is fully complying with the HBM2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die IO needed to drive the interface between the logic-die and the memory die-stack on the 2.5D Interposer.
4. 2.5D SoC Solution - This platform demonstrates a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded dual core 1GHz Arm® Cortex®-A9 Arm processors, connected across a 2.5D silicon interposer.

When and Where:
Open-Silicon booth No. 11 on exhibition floor
at Internet of Things Developers Conference
Santa Clara Convention Center,
5001 Great America Parkway,
Santa Clara, CA 95054
Date & times:
April 26 (8:30 am - 6:30 pm)
April 27 (8:30 am - 2:30 pm)
2017

About Open-Silicon:

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software, IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.