TTPCom Unveils Combined GSM & 802.11 Wireless Architecture
Silicon Companies Can Now Develop “GSM.11” Capability
October 20, 2003 - TTPCom, the world’s leading independent supplier of digital wireless technology, will give a first glimpse of its planned silicon architecture for combined GSM cellular and 802.11 wireless LAN technologies at the CTIA Wireless IT Show on 22 October in Las Vegas. The Company’s so-called “GSM.11” silicon architecture will make wireless Internet access and Voice Over Internet Protocol (VOIP) possible in mainstream, low-cost handsets.
The incorporation of 802.11 technology into a low-cost handset will allow wireless operators to accelerate their displacement of wireline business to their networks. Given adequate network support, a GSM.11 handset will seamlessly move between an in-home or in-enterprise network running VOIP and a wide area cellular network. In addition, consumers will have the low access cost of VOIP when “at home” and the added value of being in contact through a single handset when away.
TTPCom’s GSM.11 architecture delivers a low cost GSM+802.11 solution by re-using the digital blocks common to both technologies -- delivering a dual baseband on a single piece of silicon. This high level of integration is key if today’s sub-$100 retail price for a basic, high volume handset is to be maintained.
Says John Haine, Head of Research at TTPCom, “Our GSM.11 architecture is the first step towards terminal hardware able to deliver against the one-handset-for-everywhere vision. As a handset technology leader, TTPCom is the first place our industry expects to see game-changing products like this. Given the typical 12-18 months needed to develop new silicon, we can expect to see GSM.11 start to make its mark on the mass markets in 2005.”
Those interested in learning more about GSM.11 and where it fits in the wireless market landscape are invited to attend the TTPCom seminar “How Can EDGE & WLAN Technologies Bridge the Gap to 3G?” at CTIA Wireless IT Show, room 507, Sands Expo Centre, Las Vegas at 11am 22 October.
See here for more details.
|
Related News
- TTPCom delivers 802.11 Wireless Multimedia Extensions
- TTPCom acquires 802.11 Wireless LAN intellectual property from Cadence Design Foundry
- Conexant and Interpeak Launch 802.11 Wireless Solution for Embedded Developers
- ChipIdea, a leading analog and mixed-signal IP and SoC solutions provider, announces a new generation of analog front-ends (AFEs) for 802.11 Wireless LAN applications
- Accelerated Technology's Nucleus 802.11 STA Delivers Wireless Ethernet Support to Nucleus Developers
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |