1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
By Semiconductor Business News
June 6, 2001 (4:26 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010606S0002
Philips Semiconductors announced a strategic partnership with the design services subsidiary of Cadence Design Systems Inc to provide complete embedded solutions for wireless connections using Bluetooth radio-frequency links The design-services partnership for system manufacturers aimed at increasing the chances of first-time interoperability with other Bluetooth products, said Philips and Cadence's Tality Corp subsidiary in San Jose, US. First-time design success will increase the profitability of new Bluetooth products, noted the partners. The chip division of Royal Philips Electronics NV claims to be the only semiconductor supplier to sell more than one million Bluetooth baseband ICs. "This partnership will help our customers bring Bluetooth products to market rapidly and at low risk," said Gerhard Heider, manager of connectivity products at Philips Semiconductors. Under the partnership, Tality will supply Bluetooth reference modules that use baseband and RF integrated circuits from Philips. The Cadence design subsidiary company will also include its own protocol stack and application profile software with the reference design platforms. The first modules--measuring 21-by-15mm--will be made available to Bluetooth customers within the next month. "Tality has accumulated design expertise in over 30 Bluetooth system and chip designs, has a proven protocol stack, a full suite of application profiles, and has frequently demonstrated Bluetooth system interoperability," said Simon Jones, general manager of Tality's Bluetooth Business Group.
Related News
- Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks
- RivieraWaves and CSEM team up to provide the world's lowest power Bluetooth Smart integrated solution
- Analysis: Wipro's French unit closure may signal semi IP exit
- Cadence spins off services unit at Tality
- Philips Semiconductors (Eindhoven, Netherlands) and Tality Corp. (San Jose, Calif.) prep Bluetooth reference modules
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |