Zeevo Demonstrates Arm Powered(R) TC2000 Single-Chip Bluetooth(TM) Solution At the Bluetooth Conference 2001
Zeevo Demonstrates Arm Powered(R) TC2000 Single-Chip Bluetooth(TM) Solution At the Bluetooth Conference 2001
SANTA CLARA, Calif., June 6 /PRNewswire/ -- Zeevo, Inc., a privately held fabless semiconductor provider of complete SoC solutions for the communications market, today announced the successful demonstration of the Bluetooth system-on-a-chip TC2000 solution powered with an ARM7(TM) family microprocessor at the Bluetooth Conference 2001 in Monaco.
``This demonstration is the culmination of intensive implementation and vigorous testing of the ARM7TDMI microprocessor core on the TC2000 and is an important milestone for Zeevo,'' said Greg Ravenscroft, Vice President of Marketing for Zeevo. ``ARM's 32-bit processing core and efficient architecture gives Zeevo the low-power, high performance we need to successfully implement advanced functionality such as Bluetooth 1.1 compliant 128-bit encryption, scatternet, master/slave switch, and Zeevo's proprietary turbo mode as well as allowing us to offer additional bandwidth to our customers for their own applications.''
The ARM7TDMI® core is a member of the ARM7 Thumb® family, which is a range of low-power 32-bit RISC microprocessor cores optimized for cost and power-sensitive consumer applications. Offering up to 100 MIPS (Dhrystone2.1), the ARM7 Thumb family incorporates the Thumb 16-bit instruction set -- enabling 32-bit performance at 8/16-bit system cost.
``As the industry's leading embedded RISC microprocessor solution, the ARM architecture is widely used in portable computing, networking and digital camera applications -- the same applications that will be the first to exploit the benefits of Bluetooth wireless technology,'' said Reynette Au, vice president of Corporate Marketing for ARM. ``Zeevo's innovative TC2000 Bluetooth solution will enable OEMs to develop a wide range of consumer products with this single, high-performance, ARM core-based device, and help drive a new generation of 'hidden computing' solutions.''
About Zeevo
Zeevo, Inc. is a privately owned, fabless semiconductor provider of ``system-on-a-chip'' (SoC) solutions for the communications industry. The company was founded in 1999 to ``Enabling Pervasive Connectivity(TM),'' which means staying connected anytime, anywhere in order to have a true ``Personal Web'' that can be carried with you at all times. Zeevo's technology provides the industry's most integrated CMOS solutions as well as a full range of software and development tools for mass-market applications. For more information, see our web site at www.zeevo.com.
NOTE: Enabling Pervasive Connectivity(TM) is the registered trademark owned by Zeevo, Inc. Santa Clara, CA, USA.
ARM, ARM Powered, Thumb and ARM7TDMI are registered trademarks of ARM Limited. ARM7 is a trademark of ARM Limited. ``ARM'' is used to represent ARM Holdings plc; its operating company ARM Limited; and the regional subsidiaries ARM, INC.; ARM KK; ARM Korea Ltd., ARM Taiwan.
Bluetooth(TM) is the registered trademark owned by Telefonaktiebolaget LM Ericsson, Sweden.
Related News
- Freescale reveals new product platform that integrates ARM(R) Cortex(TM)-M4 and Cortex(TM)-A5 cores
- STMicroelectronics Unveils Roadmap for ARM(R) Cortex(TM)-M4 and -M0 Microcontrollers While Unleashing Ultimate Performance of Cortex-M3 With New STM32 F-2 Series
- Cypress to Showcase PSoC(R) 5 Architecture and PSoC Creator(TM) IDE for ARM(R)-Based Design
- MIPS32(R) 74K(TM) Core Featured in Broadcom's New Family of Single-Chip WLAN Router Solutions
- Enhanced Zatara(TM) ARM(R)-Based ASSP From Zilog Adds Integrated Security Features, On-Chip USB for Reduced BOM Costs and Faster Time-to-Market
Breaking News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
Most Popular
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |