NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
New ARCangel development board supports up to 2.5 million system gates for soft processor-based SoC designs
New ARCangel development board supports up to 2.5 million system gates for soft processor-based SoC designs
Elstree, UK, 4 June 2001 - A new development platform supporting the latest available FPGA technology has been introduced by ARC International plc (LSE: ARK), trading through its subsidiaries as ARC Cores. The new ARCangel 3 allows designers to evaluate SoC systems based on ARCtangent-A4? processor systems integrated with other intellectual property (IP) for designs of over 2.5 million FPGA system gates.The new development board is designed around an 1156 pin Xilinx (NASDAQ: XLNX) Virtex? XCV2000E, featuring up to 2,541,952 system gates, over 655,360 bits of block RAM and up to 804 user I/O pins. The board can also be upgraded to support the larger XCV2600E or XCV3200E FPGA devices. With this enlarged capacity, the new development platform easily supports integration of ARC?s 32-bit user-customisable processor with other logic and IP typically found in a complex SoC design. This allows comprehensive hardware-software debug and verification of different ARCtangent-A4 processor configurations, custom instructions, custom interfaces, multiple processor systems and additional IP blocks. The extensive user programmable I/O enables easy hardware debugging and interfacing to external prototyping cards and components.
The ARCangel 3 development board is fully supported by the MetaWare? software development tool set to allow rapid software development and hardware evaluation. By enabling application software development to begin early in the design cycle and provide performance feedback to the hardware design, ARCangel 3 allows developers to rapidly implement and debug an ARCtangent-A4 based system.
The ARCangel 3 carries interfaces for Ethernet and USB 1.1 ports allowing customers to evaluate and prototype systems that require these peripherals. The board can also be upgraded to support ARC?s Bluetooth? solution using a plug in card that supports Bluetooth radio cards. ARCangel 3 also features several types of memory that can be treated as one contiguous space or completely separate memories that can be used as system memory, external cache, or XY memory. Memory expansion options include off the shelf DIMM memories. The board also features non-volatile FLASH memory and configuration PROMs, allowing ARCangel 3 to be easily used as a demonstration platform. The board is designed to the industry standard NLX form factor and measures approximately 8?x11?.
Statements made in this press release that are not historical facts include forward-looking statements that involve risks and uncertainties. Important factors that could cause actual results to differ from those indicated by such forward-looking statements include, among others, market acceptance of the ARC technology; fluctuations in and unpredictability of the Company?s quarterly results; general economic and business conditions; regulatory policies adopted by governmental authorities; assumptions regarding the Company?s future business strategy; changes in technology; competition; ability to attract and retain qualified personnel; risks associated with the Company?s international operations; and other uncertainties that are discussed in the ?Investment Considerations? section of the Company?s listing particulars dated 28 September 2000 filed with the United Kingdom Listing Authority and the Registrar of Companies in England and Wales.
ARC International (UK) Ltd. and ARC Cores, Inc., both of which are wholly owned subsidiaries of ARC International plc, trade under the name of ARC Cores. ARC Cores, ARCtangent, ARCangel and ARChitect are trademarks of ARC International (UK) Ltd.
Related News
- Synopsys Launches DesignWare ARC Software Development Platforms to Accelerate Software Development of ARC Processor-based SoC Designs
- CoWare Announces Software Development Solution for ARM Cortex-A5 and ARM Cortex-M4 Processor-Based Designs
- EVE's New Emulation System Supports High-Capacity Designs of Up to One-Billion ASIC Gates
- Novas Extends Industry-Standard Debug Platform for Embedded Processor-Based System-on-Chip Designs
- TSMC Board of Directors Proposes NT$2.5 Dividend
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |