Radiation-Tolerant for Space Applications, Small Form Factor Package Can Be Wire-Bonded Within a Multi-Chip Module
MOUNTAIN VIEW, Calif., December 2, 2003 - Actel Corporation (NASDAQ: ACTL) today introduced an advanced packaging technology small enough to enable the assembly of tested and programmed FPGAs into multi-chip modules (MCMs) for space applications. Capable of delivering products with a form factor similar to bare die, the new ceramic chip carrier land grid (CCLG) package eliminates the handling, testing and programming challenges associated with using known good die (KGD) in MCMs. Actel also announced the availability of the first product based on this technology, the RT54SX32S-CC256M, which is factory tested at both extremes of the military temperature range and at room temperature prior to shipment. With today's announcement, Actel demonstrates its commitment to the military and aerospace market by delivering high-reliability, radiation-tolerant products for MCM applications.
"Actel's designed-for-space antifuse FPGAs offer a highly reliable, low-risk solution, which is especially important for mission-critical applications," said Ken O'Neill, director, military and aerospace product marketing at Actel. "In the space industry, where board area is at a premium, die-size solutions allow for the integration of different technologies in multi-chip modules. With our tried-and-tested RTSX-S technology and the CC256 package, Actel has overcome the dilemma of programming and testing at the die level to offer a compelling alternative to KGD products."
Technical Details of Actel's CC256 Package
Custom designed by Actel for its 32,000-gate, radiation-tolerant, military temperature grade RT54SX32S device, the 17mm x 17mm CCLG256 package is 78 percent smaller than its predecessor, the CQFP256. The underside of the package is a 256-pad land grid array with 1.0mm pad spacing, which enables reliable programming using programming modules supported by Actel's Silicon Sculptor II Programmer. In operation, the underside of the package is attached to the MCM substrate using an electrically non-conductive, thermally conductive attach material. The topside of the package features 256 bonding fingers, to which bond wires are attached to complete the electrical connections to other components within the MCM.
The package is hermetically sealed and employs the inherent radiation tolerant benefits of the RTSX-S architecture, including single-event latchup (SEL) immunity; >37MeV-cm2/mg single-event upset (SEU) capability; and total ionizing dose (TID) performance in excess of 100 Krads.
The CCLG256 package for RT54SX32S is available now. An application note, titled "Ceramic Chip Carrier Land Grid (CC256) Package Handling", is available on Actel's Web site at http://www.actel.com/products/rescenter/package/data.asp. For further information regarding Actel's new advanced packaging solutions, please visit the company's Web site at http://www.actel.com.
Actel Corporation is a supplier of innovative programmable logic solutions, including field-programmable gate arrays (FPGAs) based on antifuse and flash technologies, high-performance intellectual property (IP) cores, software development tools and design services, targeted for the high-speed communications, application-specific integrated circuit (ASIC) replacement and radiation-tolerant markets. Founded in 1985, Actel employs approximately 500 people worldwide. The Company is traded on the Nasdaq National Market under the symbol ACTL and is headquartered at 955 East Arques Avenue, Sunnyvale, Calif., 94086-4533. Telephone: 888-99-ACTEL (992-2835). Internet: http://www.actel.com.
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