CEVA-TeakLite DSP Core Powers High Performance EDGE Cellular Chip SAN JOSE, CA December 15, 2003
- CEVA, Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and integrated applications to the semiconductor industry, today announced that Broadcom Corporation has deployed the CEVA-TeakLite DSP Core to power the Broadcom® BCM2132 EDGE/GPRS/GSM multimedia baseband processor chip for the rapidly emerging EDGE (Enhanced Data for GSM Evolution) market.
Mobilink Telecom, which Broadcom acquired in 2002, licensed the CEVA-TeakLite DSP Core. Its decision to continue developing EDGE solutions using CEVA-TeakLite underlines CEVA's position as the leading licensor of open, industry-standard DSP cores. CEVA is the number one licensor of DSP technology to the semiconductor industry (Gartner-Dataquest, 2003).
"We are delighted that Broadcom, a leading provider of integrated circuits enabling broadband communications, have chosen CEVA's low-power, high-performance TeakLite DSP core to power their industry-leading solution for the rapidly emerging EDGE market," said Chet Silvestri, CEO of CEVA. "It is clear that with over 100 licensing partners choosing CEVA, our DSP is the architecture of choice for the next generation of wireless solutions."
CEVA-TeakLite is powering Broadcom's single-chip EDGE solution that achieves Class 12 data rates of more than 236 Kbps over GSM networks. The chip's DSP processor together with the chipset's software/hardware architecture, delivers low-power consumption for full four-slot EDGE freeing processing power for a range of integrated multimedia applications including camera, graphics engine, multiple color displays, USB, IEEE 802.11 and Bluetooth® technologies.
CEVA-TeakLite DSP is a 16-bit fixed-point general-purpose licensable DSP core designed for low power and high-performance applications such as cellular handsets, MP3 players, disk drive controllers, cordless phones, VoIP terminals and various embedded control applications. CEVA-TeakLite DSP, a fully synthesizable soft core, is process independent and easily portable to any ASIC library.
CEVA offers an unrivalled portfolio of DSP cores beginning with single-MAC (CEVA-TeakLite DSP) architecture to Dual-MAC (CEVA-Teak), Dual-MAC with Instruction Level Parallelism (CEVA-Palm DSP) and the scalable, multiple MAC and extendible architecture of CEVA-X, the latest generation DSP architecture from CEVA.
About CEVA, Inc.
Headquartered in San Jose, CEVA (NASDAQ: CEVA and LSE: CVA) is the leading licensor of DSP cores and integrated applications solutions to the semiconductor industry. CEVA markets a portfolio of DSP IP
in three integrated areas: CEVA DSPs; CEVA-Xpert Open Framework Environment; CEVA-Xpert Applications; supported by CEVA-Xpert Integration services. CEVA's products are used in over 60 million devices each year. The company was formerly known as ParthusCeva, Inc. For more information, visit www.ceva-dsp.com