Verification leader TransEDA names former Semiconductor Executive as Chief Executive Officer
Bouvresse will be responsible to build a profitable organization by merging the leading technologies of TransEDA and TNI-Valiosys and provide most advanced products for coverage and verification to companies designing Systems-on-a-Chip.
"We are very pleased to welcome Jean-Luc as Chief Executive Officer of TransEDA.", said Marc Frouin, Chief Executive Officer of TNI-Valiosys, the holding company of TransEDA. "Jean-Luc brings the expertise of strong multinational management and business development in the System-on-a-Chip market. He has shown that he can multiply business results several times over and that he can manage various size organizations from the start-up phase up to over 800m$."
As a semiconductor executive at Intel, Apple, VLSI and Philips Semiconductors, Jean-Luc Bouvresse has continually led his technical and business teams to profitability. He has consistently delivered complex SoC designs by selecting and using best of class EDA tools. His strong background in semiconductors and SoC designs give Jean-Luc a clear understanding of the design flows and methodologies required to deliver advanced technologies on time.
"We already have a large base of customers who trust us and we have a unique opportunity to deliver new tools resulting from the combined expertise in the group.", said Jean-Luc Bouvresse, Chief Executive Officer of TransEDA. "Knowing the difficulties of making SoCs, I’m confident and exited that our customers will appreciate the additional value that our tools provide for their direct development benefits."
|
Related News
- BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer
- Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer
- Rambus Names Ronald Black as President and Chief Executive Officer
- Verayo Names Eric Duprat as Chief Executive Officer
- Lattice Semiconductor Appoints New President And Chief Executive Officer
Breaking News
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- SoC Secure Boot Hardware Engine IP Core Now Available from CAST
- QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
Most Popular
- Former Moortec executives create chip monitor startup
- PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
- Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
- Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
- Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
E-mail This Article | Printer-Friendly Page |