Verification leader TransEDA names former Semiconductor Executive as Chief Executive Officer
Bouvresse will be responsible to build a profitable organization by merging the leading technologies of TransEDA and TNI-Valiosys and provide most advanced products for coverage and verification to companies designing Systems-on-a-Chip.
"We are very pleased to welcome Jean-Luc as Chief Executive Officer of TransEDA.", said Marc Frouin, Chief Executive Officer of TNI-Valiosys, the holding company of TransEDA. "Jean-Luc brings the expertise of strong multinational management and business development in the System-on-a-Chip market. He has shown that he can multiply business results several times over and that he can manage various size organizations from the start-up phase up to over 800m$."
As a semiconductor executive at Intel, Apple, VLSI and Philips Semiconductors, Jean-Luc Bouvresse has continually led his technical and business teams to profitability. He has consistently delivered complex SoC designs by selecting and using best of class EDA tools. His strong background in semiconductors and SoC designs give Jean-Luc a clear understanding of the design flows and methodologies required to deliver advanced technologies on time.
"We already have a large base of customers who trust us and we have a unique opportunity to deliver new tools resulting from the combined expertise in the group.", said Jean-Luc Bouvresse, Chief Executive Officer of TransEDA. "Knowing the difficulties of making SoCs, I’m confident and exited that our customers will appreciate the additional value that our tools provide for their direct development benefits."
|
Related News
- BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer
- Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer
- Rambus Names Ronald Black as President and Chief Executive Officer
- Verayo Names Eric Duprat as Chief Executive Officer
- Lattice Semiconductor Appoints New President And Chief Executive Officer
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |