EverOn Ultra Low Voltage Embedded SRAM TSMC 40ULP Embedded Flash
STMicroelectronics Announces Embedded Dual-Mac DSP Core Running Above 600MHz
Based on ST's innovative ST100 DSP architecture with customizable instruction sets, new ST122 core runs at 600MHz
Geneva, December 17, 2003 - STMicroelectronics (NYSE:STM) today announced the release of an embeddable digital signal processor (DSP) core that can be implemented in versions that run at above 600MHz or that consume less than 0.1mW/MMAC (Million MAC) in a typical portable telecom application. Based on ST's innovative ST100 DSP architecture that allows user-customized instruction sets, the new ST122 Dual MAC core is supported by an evaluation chip fabricated in 130nm technology and a complete development platform.
Available in the form of synthesizable IP, the ST122-DSP can be mapped into various versions ranging from ultra-low power to high speed operation. This flexibility makes it ideal for a broad spectrum of applications including new generation mobile terminals, cellular infrastructure equipment, networking, broadband modems, voice-over-IP, data storage and mobile multimedia.
Like all cores based on the ST100 architecture, the ST122 core combines VLIW and RISC features to achieve the best balance between performance and code size. Flexible instruction modes allow a mixture of 16, 32 and 128-bit instructions and instruction sets can be customized to add applications-specific operators. Custom extensions have demonstrated an important performance boost in ADSL, GPRS/EDGE, audio and video algorithms while adding minimal silicon overhead. Custom instructions are controlled through the ST100's tightly coupled co-processor extension interface and are fully supported by the ST100 DSP toolchain.
To support the most demanding performance needs the new dual-MAC ST122 core can fetch four 32-bit instructions using 128-bit instruction mode and execute them in a single clock cycle. High performance is the result of ST's advanced digital design techniques and a unique architecture design feature that enables direct memory access at CPU speeds. Highly efficient memory interfaces allow the connection of a large amount of flat data memory. The ST122 evaluation device includes 16Kbytes of L1 Program cache, 256kBytes of L2-Program memory and 2x64Kbytes of data memory accessed at the DSP core's maximum clock speed.
Designed for easy and optimal integration into complex system-on-chip products, the ST122 is supported by a full range of peripherals. Configurable plugs supporting AMBA®bus from ARM® or specific fast access ports make it easy to interconnect efficiently multiple DSP and MCU cores in SoC devices. Multicore debug is fully supported in such cases.
The ST122 core, peripherals and configurable interfaces are all synthesizable soft IPs available for easy physical integration in application chips. ST can also provide ST122-DSP subsystems as optimized hard macros ready on demand.
"Today the challenge facing equipment manufacturers is to add new functionalities while reducing cost, and this can only be achieved by super-integrating DSP cores, MCU cores, memories and other functions into a single SoC chip," explained Jean-Claude Michalina, General Manager of ST's DSP and Micro Division. "With the ST122 we maintain the ST100 DSP family at the leading edge of DSP performance, support advanced system features and offer designers a complete development platform."
Software development is supported by a state-of-the-art integrated software toolchain which includes a highly-optimizing C compiler providing best-in-class performance and code size, plus advanced system modeling tools, easy program build with graphical interface, code profiling facilities and multi-core debugging.
The ST122-DSP is embedded in STMicroelectronics products that will soon be introduced to the market. It is available for licensing to customers and partners.
For more information on these devices visit www.st.com/st100
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2002, the Company's net revenues were $6.32 billion and net earnings were $429.4 million.
Further information on ST can be found at http://www.st.com.
|
Related News
- DSP Group selects Verisity's Specman Elite to cut Verification Time for latest Dual MAC DSP Cores
- DSP Group announces evaluation development platform (EDP) based Dual MAC Teak core
- DSP Group Announces Evaluation Development Platform (EDP) for Dual MAC Parallel PalmDSPCore
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Breaking News
- Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
E-mail This Article | Printer-Friendly Page |