TTPCom implements AMR codec in GX20 camera phone from Sharp Corporation
Dedicated support team speeds time to market for new technology
January 7, 2004 - The GX20 camera phone from Sharp Corporation is the first to implement TTPCom’s adaptive multi-rate (AMR) speech codec. The inclusion of the AMR codec in the GX20 enables the phone to deliver enhanced multimedia messaging services (MMS) – such as the recording and playing of voice clips. AMR is included in the 3rd Generation Partnership Project (3GPP) specification and is in demand from network operators for the deployment of 3G style services; AMR is fully compatible with 3G phones and services.
To reduce development time for the GX20 Sharp took advantage of TTPCom’s new enhanced engineering services. This service gives access to a dedicated support team for a defined period during the development process and can be used to address specific product or technology needs, to support conformance testing or to conduct operator field trials. For the GX20, TTPCom provided dedicated engineers at the development and integration stages and undertook extensive interoperability trials to ensure compatibility of the AMR technology with existing hardware.
“AMR is an important step forwards in the provision of exciting new multimedia services and we’re working closely with Sharp to ensure that the very latest service and technology upgrades are integrated quickly into their new handsets,” stated Gordon Aspin, Operations Director at TTPCom. “With over 13 years experience in wireless technology TTPCom has developed an enviable reputation for getting customers to market with leading edge GSM and GPRS products. As the mobile phone market becomes more competitive and as new product development times decrease, we felt it was essential that we developed a service that enables our customers to access specific TTPCom expertise as and when they need it. The result of this new service is reduced product development time and much faster time to market”.
Steve Bold, Managing Director of Sharp Telecoms of Europe said “The GX10, built on TTPCom’s GSM/GPRS technology, has been a tremendous success. We are always looking for ways in which we can enhance our handsets and give our users an even more rewarding experience. We are very pleased with TTPCom’s responsiveness and their new engineering service has made the development process run smoothly and enabled us to meet the tight deadlines for the launch of the GX20 camera phone”.
TTPCom and Sharp have a long-term vision to deliver advanced features on mobile phones and the two companies are already working on the next generation of GSM/GPRS phones and applications.
|
Related News
- NTT DOCOMO, Renesas, Fujitsu, and Sharp to Jointly Develop Platform for HSUPA Mobile Phone
- DSP Group Becomes a Licensee of SPIRIT DSP Low Bitrate Voice Codec for Digital Phone Baseband Processors and SoCs
- Paragon Wireless Chooses SoftRISC's Codec Solution for its GSM/VoWLAN Dual-Mode Smart Phone
- Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed With NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets
- NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson to Jointly Develop Platform for 3G Mobile Phone Handsets
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |