TSMC 4nm (N4P) 1.2V/1.8V Basekit Libraries, multiple metalstacks
Trial Court Denies Infineon Request for Stay of Rambus Patent Claim Trial
Number of Claims to be Tried Also Limited by Trial Court
Los Altos,CA - January 08, 2004 - Rambus Inc. (Nasdaq: RMBS), a leading developer of chip-to-chip interface products and services, today announced that in its lawsuit against Infineon Technologies AG (NYSE: IFX) the United States District Court for the Eastern District of Virginia issued several rulings today. Included among them was the denial of a request by Infineon to stay the trial pending rulings by the Federal Trade Commission (FTC) in its own complaint against Rambus.Rambus' patent infringement trial against Infineon is now set to begin on May 10, 2004.
In other rulings from the bench, the District Court limited to four the number of patent claims to be tried against Infineon, ruling that other claims were not the subject of Rambus' successful appeal decided by the Court of Appeals for the Federal Circuit on January 29, 2003.
About Rambus Inc.Rambus is one of the world's leading providers of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus's interface solutions can be found in numerous computing, consumer electronic and networking products. Additional information about the company is available at www.rambus.com.
|
Related News
- United States Supreme Court Denies FTC Request to Review Rambus Matter
- Rambus Announces Resetting of Infineon Patent Trial Date
- Rambus and Infineon Renew Patent License Agreement
- US District Court Accepts Kilopass' Expanded Complaint and Denies Sidense's Motion for Dismissal in Patent Lawsuit
- Court Declares Rambus Patents in Suit Unenforceable in Micron Delaware Case
Breaking News
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |