SAN JOSE, CA, JANUARY 13, 2004 -- Xilinx, Inc. (Nasdaq: XLNX) has issued a product advisory potentially affecting certain lots of its Virtex-II Pro and XC2V6000 products using flip chip technology. The affected parts were manufactured using improper solder material that may cause random upset of device configuration. This issue is isolated to a limited number of parts assembled in calendar 2003, using a packaging substrate from only one of our substrate vendors. The issue has subsequently been resolved and shipments with proper solder have resumed. Xilinx is currently identifying and notifying all customers and is working on an individual basis with customers to address their particular situation. There will be no material impact on the December quarter 2003 or March quarter 2004 financial results.
This release contains forward-looking statements and projections. Actual events and results may differ materially from those in the forward-looking statements and are subject to risks and uncertainties including our ability to deliver replacement product to customers in a timely manner, reliance upon third party suppliers, Xilinx's ability to accurately identify all affected products in inventory, and other risk factors listed in our most recent Form 10K.
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