Kawasaki Microelectronics Partners with CEVA To Add Fully Compliant 1.5Gbps Serial ATA Macro to its 0.13 um ASIC IP Portfolio
SAN JOSE, Calif. – February 2, 2004 – Kawasaki Microelectronics, a leader in advanced yet affordable ASICs, announced today that it has partnered with CEVA Inc., (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processing (DSP) and communications IP to the semiconductor industry, to add a fully compliant 1.5Gbps Serial ATA macro to its 0.13m ASIC intellectual property (IP) portfolio.
Kawasaki has licensed CEVA’s Xpert-Connect SATA application IP for a range of storage applications such as SATA Host Controllers, SAN/NAS & RAID, and SATA Router Switch Mux (RSM) devices. Interoperability has already been achieved with leading Serial ATA drives such as the Seagate Barracuda, Western Digital Raptor and Maxtor Diamond-Plus. Customers can immediately use this macro, which incorporates both PHY and Protocol layers, to add a Serial ATA interface to their Kawasaki 0.13m ASIC designs.
“Serial ATA is replacing parallel ATA as the preferred interface for storage applications, and we needed to add support for it to meet requirements from our customers”, said Hisaya Keida, General Manager, Product Marketing and Development Dept. of Kawasaki. “After evaluating a number of Serial ATA IP vendors, we concluded that CEVA’s Xpert-Connect SATA technology was clearly the best choice because it is fully compliant, proven interoperable, and consumes only 70mW per channel power.”
“We are very pleased to have partnered with Kawasaki in developing and deploying our Xpert-Connect SATA technology”, said John Ryan, Vice President of Communications Business Unit of CEVA. “With the addition of our Serial ATA IP, Kawasaki now has a broad portfolio of SoC technology for storage applications. Coupling its portfolio with its affordable prices makes Kawasaki an excellent choice for storage vendors looking for an ASIC supplier.”
About Kawasaki Microelectronics
Kawasaki Microelectronics is the leader in advanced yet affordable ASIC semiconductor technology solutions. The company’s innovative core technologies and world-class design support are used in the consumer electronics, computer, office-automation, networking, wireless, and electronic-storage markets. Deployed worldwide, Kawasaki’s products enable customers to quickly introduce highly competitive solutions. The company is an active participant in industry standards organizations, including the Network Processing Forum (NPF), Optical Internetworking Forum (OIF), PCI Special Interest Group (PCI-SIG), USB Implementers Forum, MPEG Industry Forum (MPEGIF), Mobile Computing Promotion Consortium (MCPC), and the Digital Display Working Group (DDWG). Kawasaki has design centers in Boston, Osaka, San Jose, Taipei, and Tokyo. For more information, contact the company at 408-570-0555, or visit its English-language web site at http://www.klsi.com/, its Japanese-language web site at http://www.k-micro.com/, or e-mail to info@k-micro.com.
About CEVA, Inc.
Headquartered in San Jose, CEVA (NASDAQ: CEVA and LSE: CVA) is the leading licensor of DSP cores and communications solutions to the semiconductor industry. CEVA markets a portfolio of DSP IP in three integrated areas: CEVA DSPs, CEVA-Xpert Open Framework Environment, and CEVA-Xpert Applications, all supported by Xpert Integration services. CEVA’s products are used in over 60 million devices each year. The company was formerly known as ParthusCeva, Inc. For more information, visit www.ceva-dsp.com
# # #
|
Ceva, Inc. Hot IP
Related News
- JMicron Develops Serial ATA II (3.0 Gbps) PHY Core on UMC's 0.13 Micron Process
- LSI Logic first with Serial ATA 1.0 ASIC implementation - expands high-speed interface portfolio
- Faraday Introduces 533 MHz Embedded RISC CPU Core FA626 Using UMC 0.13 um Process
- Faraday's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's 0.13 um Technology
- Barcelona Design Achieves Milestone at 0.13 um Technology Node
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |