LOS ALTOS, Calif.--(BUSINESS WIRE)--Feb. 13, 2004 -- Rambus Inc. (Nasdaq:RMBS), a leading provider of chip-to-chip interface products and services, today announced that it will be showing the first public demonstration of Toshiba Corporation's 512-megabit XDR(TM) DRAM. The demonstration will take place in the Rambus booth (#502) at the 2004 Intel Developer Forum (IDF) being held February 17 - 19, 2004 at the Moscone Center in San Francisco. Samsung also plans to showcase its XDR DRAM for the first time at the event. Running at 3.2GHz, XDR DRAM is the world's fastest memory device, offering eight times the bandwidth of today's best-in-class main memory.
"Last December, we broke new ground once again when we were first to begin sampling the world's fastest memory," said Shozo Saito, Technology Executive of Semiconductor Company at Toshiba Corporation. "By combining our advanced expertise in trench capacitor cell technology and high speed DRAM with Rambus's ingenious chip-to-chip interface technology, we successfully developed this extraordinary chip, capable of delivering unprecedented multi-gigahertz of data to power future consumer and graphics devices."
"Providing our customers with XDR DRAMs will allow us to continue supplying the market with high-quality memory products that provide exceptional bandwidth capabilities," said Tom Quinn, vice president of Samsung Semiconductor memory sales and marketing. "We look forward to ramping XDR DRAM into high-volume production in 2004 and 2005."
XDR DRAMs are based on Rambus's XDR memory interface technology. Three of the key innovations include:
- Differential Rambus Signaling Level (DRSL) -- a bi-directional differential signaling technology offering a high-performance, low-power, and cost-effective solution for getting bandwidth on and off chip;
- Octal Data Rate (ODR) -- a technology that enables eight bits of data to be transferred on each clock edge, four times as many as today's state-of-the-art double data rate (DDR);
- FlexPhase -- a circuit architecture that enables precise data transfer and simplifies system designs.
"This first demonstration of XDR DRAM is a key milestone, bringing us one step closer to providing XDR DRAM in high volume to the market," said Laura Stark, vice president of the Memory Interface Division at Rambus. "We are pleased that Toshiba and Samsung are in the process of sampling XDR DRAMs and look forward to their ramp to volume production later this year and into 2005."
XDR DRAMs are designed for high-performance broadband applications, including digital consumer electronics, network systems and graphic systems. These applications process data at very high speeds in real time, and therefore require ultra high-speed memory chips. Toshiba recently announced it is the first to begin sampling its 512-megabit XDR DRAM. In addition to Toshiba, Rambus has licensed its XDR memory interface technology to Elpida Memory, Inc. and Samsung Electronics Co., Ltd. These manufacturers expect to ship XDR DRAM later this year and ramp to volume production in 2005. Additional information on XDR DRAM and the memory interface can be found at www.rambus.com/xdr.
Toshiba Corporation is a leader in the development and manufacture of electronic devices and components, information and communication systems, consumer products and power systems. The company's ability to integrate wide-ranging capabilities, from hardware to software and innovative services, assure its position as an innovator in diverse fields and many businesses. In semiconductors, Toshiba continues to promote its leadership in the fast growing system-on-chip market and to build on its world-class position in NAND flash memories, analog devices and discrete devices. Toshiba has approximately 166,000 employees worldwide and annual sales of over US$47 billion. Visit Toshiba's website at www.toshiba.co.jp/index.htm.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, and digital convergence technology. Samsung Electronics employs approximately 75,000 people in 89 offices in 47 countries and business performance for 2002 record $49.6 billion in sales and $5.9 billion in net income. Samsung Electronics is the world's leading company of advanced semiconductors, TFT-LCDs, CDMA mobile phones, monitors and VCRs. Samsung Electronics consists of four main business units: Device Solution Network, Digital Media Network, Telecommunication Network and Digital Appliance Network Businesses.
The Device Solution Network specializes in semiconductors, TFT-LCD displays and data storage medium for industrial, mobile and advanced computing applications, offering a full line of key solutions of DRAMs, SRAMs, Display Driver ICs, Smart Card ICs, TFT-LCD panels and Flash memories. The Device Solution Network operates overseas sales subsidiaries and mass production facilities to maximize on hand customer support. For more information, visit our website at http://www.samsungsemi.com.
Samsung Semiconductor Inc., a wholly owned U.S. subsidiary of Samsung Electronics Co., Ltd., is located in San Jose, Calif. More information can be found at http://www.usa.samsungsemi.com/.
About Rambus Inc.
Rambus is one of the world's leading providers of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus's interface solutions can be found in numerous computing, consumer electronic and networking products. Additional information is available at www.rambus.com.
Rambus is a registered trademark of Rambus Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.
This release contains forward-looking statements that are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements include statements about the adoption rate of XDR DRAM into and suitability for the consumer, graphics, networking, PC main memory, server and mobile markets, as well as the dates of when XDR DRAMs are expected to ship into their respective markets and ramp into volume production. Additional forward-looking statements include the ability of XDR DRAM to provide cost benefits while still outperforming low-volume specialty DRAMs. These forward-looking statements are subject to risks and uncertainties, which could cause actual results to differ materially from those projected. Those risks include the possibility of inadequate shipments of Rambus XDR memory devices and controllers for the specified markets, the market response to these products, the continued deterioration in the DRAM market, any delay in the development of Rambus-based products by licensees, any delay in the development and shipment of new Rambus products, any delay in the development and shipment of products compatible with Rambus products, a strong response of the market to competing technology, a failure to sign new contracts or maintain existing contracts for XDR memory, adverse litigation decisions and other factors that are described in our SEC filings including our 10-K and 10-Qs.