CEVA to Showcase Leading DSP Cores and Integrated Solutions at 3GSM World Congress
San Jose, CA - February 18, 2004 - CEVA, Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced its demonstration line-up for this year's 3GSM World Congress in Cannes, France between February 23-26, 2004.
At Hall 5, hospitality suite M18, CEVA will be demonstrating its latest generation of DSP cores, tools and application platforms including:
- CEVA-X DSP Architecture - CEVA-X is a pioneering new DSP architecture that offers best-in-class performance, scalability and lowest cost-of-development in DSP deployment. Launched in late 2003, CEVA-X has already been adopted by leading handset and semiconductor companies.
- Xpert-Media™ - This new DSP powered audio and video media processing platform delivering audio, video and image processing for cellular, consumer multi-media and home entertainment markets. Based on proprietary patented video compression and decompression software acceleration technologies, Xpert-Media eliminates the need for current generation hardware acceleration and co-processors to the central chip.
- Xpert-GPS™ - Xpert-GPS is the latest generation of CEVA's high-performance GPS location platform. With the option of being powered by CEVA DSP cores, Xpert-GPS delivers the complete GPS solution, offering unrivalled performance in terms of accuracy, time-to-first-fix and power consumption.
- Xpert-Middleware - A complete middleware suite for CEVA DSPs with pre-defined software provides easy application development and multi-tasking run-time environment enabling parallel processing of multiple algorithms running concurrently on CEVA DSPs.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
|
Ceva, Inc. Hot IP
Related News
- CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
- CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007
- CEVA to Showcase Continued Leadership in IP for Wireless Handset Applications at 3GSM World Congress 2006
- Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016
- CEVA to Showcase a Range of Solutions for the Future of Mobile Computing at Mobile World Congress 2014
Breaking News
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |