NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Panel debates fate of IP core startups


![]() ![]() | |
EE Times: Latest News Panel debates fate of IP core startups | |
Brian Fuller (03/01/2004 12:00 PM EST) URL: http://www.eetimes.com/showArticle.jhtml?articleID=18201249 | |
Paris - The days of the small intellectual-property (IP) core vendor aren't numbered, but customer interest in vendor consolidation makes the survival of startups in this business sector increasingly difficult. "I don't want to be the bearer of bad news, but the barriers to [market] entry are big," Philippe Magarshack, vice president of central R&D for STMicroelectronics, told a panel at the Design Automation and Test in Europe conference here last month. "I'm interested in long-term relationship, partnership-style." ST is "not interested" in contracting with two guys doing an MPEG decoder in their garage, Magarshack added. Mike Kaskowitz, vice president and general manager for Mentor Graphics Corp.'s IP division, said, "It's very difficult. When you get to the technical sell, it's tough. They want engineers on site to help them out. That's almost impossible." Hal Barbour of Cast Inc., a small IP vendor, chimed in from the audience to rebut the notion. "It's not a glorious business; it's a nuts-and-bolts business. For people who have that kind of focus, I don't care how small you are, there's lots of future in the IP business." While some argued that IP is going to become the forte of the foundries, Kevin Meyer, vice president of marketing and services at foundry Chartered Semiconductor Manufacturing, said it won't be a complete shift. "I don't see that," he said. "We would prefer to stay on process development and our value-add in that respect. We continue to work with partners on design enablement." http://www.eet.com
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
- FSA panel debates crosstalk doom
- Panel debates value of mixed-signal design tools
- Intel and Arm Team Up to Power Startups
- EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations
- 2 Startups Tackle Counterfeits, Including TI Chips
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |