High Cost of SOC Forces Look at system-in-package (SiP)
Electronics Weekly
The increasingly prohibitive cost of SOCs is forcing companies to use the system-in-package (SiP) approach of stacking die.
"Something has to be done to overcome the fundamental problem of SOC, which is its rapidly increasing cost and, compared with SOC, SiP is low-cost and with short time-to-market," said Tsugio Makimoto, corporate adviser at Sony.
Read more ...
Related News
- Sequans Provides Chips to USI to Develop Mobile WiMAX End User Devices and System-in-Package (SIP) Modules
- Fukuoka Intelligent Cluster Laboratory Chooses eASIC’s Nextreme Devices for its Unique System-in-Package (SiP) Development
- Pressures tilt wireless apps toward System-in-Package (SiP)
- Inapac Technology Releases New DRAM IP Designs Optimized for System-in-Package (SiP) Applications
- System-in-package (SIP) may not be that simple
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |