By David Manners -- 3/10/2004 Electronics Weekly The increasingly prohibitive cost of SOCs is forcing companies to use the system-in-package (SiP) approach of stacking die.
"Something has to be done to overcome the fundamental problem of SOC, which is its rapidly increasing cost and, compared with SOC, SiP is low-cost and with short time-to-market," said Tsugio Makimoto, corporate adviser at Sony.
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